Abstract: A resettable injection training device embodiment is provided. In one embodiment, the device may include an outer housing comprising locking tabs at its proximal end, a safety shield, the safety shield being slidable relative to the outer housing between a ready-to-fire position, and a fired position, wherein when the safety shield is in a fired position, the injection simulation member is retracted into the outer housing. The device may further include a plunger comprising a proximal end and a distal end, the proximal end comprising a plunger contact portion for interfacing with the locking tabs to displace the locking tabs to unlock the safety shield, and a biasing member disposed between the outer housing and the safety shield to extend the shield in a proximal direction upon release of the locking tabs, wherein retraction of the plunger and proximal movement of the outer housing resets the device.

Abstract: A resettable injection training device embodiment is provided. In one embodiment, the device may include an outer housing comprising locking tabs at its proximal end, a safety shield, the safety shield being slidable relative to the outer housing between a ready-to-fire position, and a fired position, wherein when the safety shield is in a fired position, the injection simulation member is retracted into the outer housing. The device may further include a plunger comprising a proximal end and a distal end, the proximal end comprising a plunger contact portion for interfacing with the locking tabs to displace the locking tabs to unlock the safety shield, and a biasing member disposed between the outer housing and the safety shield to extend the shield in a proximal direction upon release of the locking tabs, wherein retraction of the plunger and proximal movement of the outer housing resets the device.

Abstract: The present invention relates to an external stiffener featuring reinforcing bars and a polymer and a method to make the same. In an embodiment, the stiffener may be used to decrease warpage in the package substrate caused by high temperature processing. In an embodiment, the reinforced bars are disposed over the die attach side of the package substrate. In an embodiment, the polymer may encapsulate a semiconductor die coupled to a package substrate.

Abstract: In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.