Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: A surgical thread for plastic surgery operations includes a clear section and multiple sharp projections on either side of the clear section. The clear section is devoid of projections while the projections on both sides of the clear section are inclined toward the clear section. There is also a method of performing plastic surgery operations using this surgical thread which includes threading the thread subcutaneously through tissue and/or muscle and in a manner such that the thread is folded back on itself as a loop or sling. The thread tension is then adjusted from both ends of the thread which extend out of two separate exit points to achieve a desired lift. The projections resist thread pull in the direction of the entry point and the clear section is located at the fold.

Abstract: A surgical thread for plastic surgery operations includes a clear section and multiple sharp projections on either side of the clear section. The clear section is devoid of projections while the projections on both sides of the clear section are inclined toward the clear section. There is also a method of performing plastic surgery operations using this surgical thread which includes threading the thread subcutaneously through tissue and/or muscle and in a manner such that the thread is folded back on itself as a loop or sling. The thread tension is then adjusted from both ends of the thread which extend out of two separate exit points to achieve a desired lift. The projections resist thread pull in the direction of the entry point and the clear section is located at the fold.