Patents by Inventor Tze Ping Chan

Tze Ping Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
    Publication number: 20240260237
    Abstract: A semiconductor storage device includes semiconductor packages mounted on a printed circuit board (PCB) and encased within an enclosure. The semiconductor storage device includes thermal interface material mounted on side edges of the PCB. During depaneling (separation) of individual semiconductor storage devices from a PCB panel, edges of the PCB may be overcut to expose thermally conductive edge layers provided within the interior the PCB. The thermal interface material may be positioned adjacent to the exposed thermally conductive edge layers to conduct heat away from a semiconductor package through the side edges of the PCB and out of sides of the enclosure.
    Type: Application
    Filed: July 17, 2023
    Publication date: August 1, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Wei Hong Tew, Chun Sean Lau, Tze Ping Chan