Patents by Inventor Tze Wei Dennis Chew

Tze Wei Dennis Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive bonding technique for use with capacitive micro-sensors
    Patent number: 9082681
    Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: July 14, 2015
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: Olivier Le Neel, Shian-Yeu Kam, Tien-Choy Loh, Ditto Adnan, Tze Wei Dennis Chew
  • ADHESIVE BONDING TECHNIQUE FOR USE WITH CAPACITIVE MICRO-SENSORS
    Publication number: 20140291829
    Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Applicant: STMicroelectronics Pte Ltd.
    Inventors: Olivier Le Neel, Shian-Yeu Kam, Tien-Choy Loh, Ditto Adnan, Tze Wei Dennis Chew