Abstract: Optical receivers and a method for providing a diagnostic measurement of optical modulation amplitude at other than a signal output of an optical receiver are invented and disclosed. The method includes the steps of applying a representation of an output of an optical detector to a circuit that determines a difference between a first signal level and a second signal level that is different from the first signal level and buffering the difference between the first signal level and the second signal level received from the circuit. The optical receivers include an optical detector, a transimpedance amplifier that applies automatic gain control, a circuit that determines a difference between two signal values and a limiting post amplifier. The receivers provide a diagnostic measure that can be compared to certain thresholds relating to known bit error rates or applied in a calculation to generate an absolute optical modulation amplitude value.

Abstract: Optical receivers and a method for providing a diagnostic measurement of optical modulation amplitude at other than a signal output of an optical receiver are invented and disclosed. The method includes the steps of applying a representation of an output of an optical detector to a circuit that determines a difference between a first signal level and a second signal level that is different from the first signal level and buffering the difference between the first signal level and the second signal level received from the circuit. The optical receivers include an optical detector, a transimpedance amplifier that applies automatic gain control, a circuit that determines a difference between two signal values and a limiting post amplifier. The receivers provide a diagnostic measure that can be compared to certain thresholds relating to known bit error rates or applied in a calculation to generate an absolute optical modulation amplitude value.

Abstract: Optical receivers and a method for providing a diagnostic measurement of optical modulation amplitude at other than a signal output of an optical receiver are invented and disclosed. The method includes the steps of applying a representation of an output of an optical detector to a circuit that determines a difference between a first signal level and a second signal level that is different from the first signal level and buffering the difference between the first signal level and the second signal level received from the circuit. The optical receivers include an optical detector, a transimpedance amplifier that applies automatic gain control, a circuit that determines a difference between two signal values and a limiting post amplifier. The receivers provide a diagnostic measure that can be compared to certain thresholds relating to known bit error rates or applied in a calculation to generate an absolute optical modulation amplitude value.

Abstract: A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: Various embodiments of duplex fiber optic connectors and optical transceiver modules are provided. One embodiment comprises an optical transceiver module comprising: an integrally-formed housing having a duplex front port with a pair of alignment holes for receiving a pair of ferrules from a duplex fiber optic connector, the duplex front port having an upper flexible retaining element and a lower flexible retaining element for retaining the pair of ferrules from the duplex fiber optic connector; an opto-electronic assembly contained within the housing; and an electrical interface extending from the integrally-formed housing.

Abstract: Optical receivers and a method for providing a diagnostic measurement of optical modulation amplitude at other than a signal output of an optical receiver are invented and disclosed. The method includes the steps of applying a representation of an output of an optical detector to a circuit that determines a difference between a first signal level and a second signal level that is different from the first signal level and buffering the difference between the first signal level and the second signal level received from the circuit. The optical receivers include an optical detector, a transimpedance amplifier that applies automatic gain control, a circuit that determines a difference between two signal values and a limiting post amplifier. The receivers provide a diagnostic measure that can be compared to certain thresholds relating to known bit error rates or applied in a calculation to generate an absolute optical modulation amplitude value.

Abstract: A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.

Abstract: Various embodiments of duplex fiber optic connectors and optical transceiver modules are provided. One embodiment comprises an optical transceiver module comprising: an integrally-formed housing having a duplex front port with a pair of alignment holes for receiving a pair of ferrules from a duplex fiber optic connector, the duplex front port having an upper flexible retaining element and a lower flexible retaining element for retaining the pair of ferrules from the duplex fiber optic connector; an opto-electronic assembly contained within the housing; and an electrical interface extending from the integrally-formed housing.

Abstract: An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Abstract: A seal is formed by compressing a cured layer of a composition applied on a substrate. The composition is any liquid, liquefiable, or mastic, which, after application to a surface, is converted or cured to a compressible solid film. The composition includes a flexible polymer as a binding material. The layer on the substrate eliminates the need for a gasket on a contact surface of a mold. The contact surface of the mold compresses the layer during an encapsulation process. The layer remains on the substrate in a finished product. A minimum separation or wall thickness of the mold is defined by the material properties of the mold. The seal eliminates yield loss due to leakage of an encapsulant and reduces maintenance costs associated with the procurement and repeated installation of gaskets on mold tooling.

Abstract: Various embodiments of optical subassemblies, and arrangements and methods for manufacturing same, for an electro-optical assembly are disclosed. One embodiment comprises an optical subassembly for an electro-optical assembly. The optical subassembly comprises a printed circuit board, an optical semiconductor device, and an optical element. The printed circuit board has a first surface, a second surface, and an aperture therethrough. The optical semiconductor device is attached to the first surface with an active region exposed to the aperture. The optical element is attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region.

Abstract: Various embodiments of optical subassemblies, and arrangements and methods for manufacturing same, for an electro-optical assembly are disclosed. One embodiment comprises an optical subassembly for an electro-optical assembly. The optical subassembly comprises a printed circuit board, an optical semiconductor device, and an optical element. The printed circuit board has a first surface, a second surface, and an aperture therethrough. The optical semiconductor device is attached to the first surface with an active region exposed to the aperture. The optical element is attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region.

Abstract: An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Abstract: A small form factor pluggable (SFP) optical transceiver module and method for performing optical communications are provided. The SFP optical transceiver module has a housing to which a duplex receptacle is secured. The duplex receptacle has a C-shaped opening, the upper and lower portions of which are defined by upper and lower flexible retaining elements for receiving and retaining a duplex optical connector therein. An electrical assembly of the module is secured within the transceiver module housing. The electrical assembly comprises a PCB, the back end of which is configured as a plug end for removably plugging the PCB into a receptacle of an external communications management system.

Abstract: Various embodiments of duplex fiber optic connectors and optical transceiver modules are provided. One embodiment comprises an optical transceiver module comprising: an integrally-formed housing having a duplex front port with a pair of alignment holes for receiving a pair of ferrules from a duplex fiber optic connector, the duplex front port having an upper flexible retaining element and a lower flexible retaining element for retaining the pair of ferrules from the duplex fiber optic connector; an opto-electronic assembly contained within the housing; and an electrical interface extending from the integrally-formed housing.

Abstract: Various embodiments of duplex fiber optic connectors and optical transceiver modules are provided. One embodiment comprises an optical transceiver module comprising: an integrally-formed housing having a duplex front port with a pair of alignment holes for receiving a pair of ferrules from a duplex fiber optic connector, the duplex front port having an upper flexible retaining element and a lower flexible retaining element for retaining the pair of ferrules from the duplex fiber optic connector; an opto-electronic assembly contained within the housing; and an electrical interface extending from the integrally-formed housing.