Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.

Abstract: The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.

Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: A flip-chip light-emitting diode structure capable of emitting trichromatic spectrum and a manufacturing method thereof, including a blue-green light layer with a light-stimulated green light-emitting structure and an electron-stimulated blue light-emitting structure, a bonding layer and a red light layer with a light-stimulated red light-emitting structure. The manufacturing method uses a sapphire bonding layer as the bonding layer, and forming the blue-green light layer and the red light layer by growing epitaxy on two sides of the sapphire bonding layer; or, after growing the blue-green light layer and the red light layer by epitaxy respectively, uses the bonding layer to connect.

Abstract: A vertical light-emitting diode structure with a metal layer capable of testing and protecting sidewalls comprises a light-emitting diode element, a sidewall passivation layer, a welding electrode and a metal protective layer, which mainly allows the metal protective layer to be electrically connected to the welding electrode, and the metal protective layer covers and protects a chip side edge and a carrier board side edge of the light-emitting diode element with the sidewall passivation layer in between. Accordingly, through coating and protection of the metal protective layer, the problem of potential failure of the sidewall passivation layer of the light-emitting diode element during electroplating, electroless plating process or other environmentally rigorous processes can be solved, and the metal protective layer can provide test contacts, a quality of the sidewall passivation layer is evaluated by detecting forward bias (Vf) and reverse leakage current (Ir) of the light-emitting diode element.

Abstract: A three-in-one RGB mini-LED device includes a substrate, a second electrical semiconductor layer, a plurality of multiple-quantum well layers, a plurality of first electrical semiconductor layers, and a plurality of mirrors. The second electrical semiconductor layer is disposed on the substrate. The plurality of multiple-quantum well layers are disposed on the second electrical semiconductor layer. An area of each of the plurality of multiple-quantum well layers is smaller than an area of the second electrical semiconductor layer, and a region on the second semiconductor layer is not covered by the plurality of multiple-quantum well layers.

Abstract: A surface light source LED device includes a circuit board, at least one power input and at least two LED bar elements, the at least two LED bar elements are arranged in a staggered manner, and each of the LED bar elements includes a plurality of LED bars arranged linearly on the circuit board. Each of the LED bars has a straight strip structure and has a plurality of LED dies of the same type provided inside. The plurality of LED dies is arranged linearly at equal intervals.

Abstract: A surface light source LED device includes a circuit board, at least one power input and at least two LED bar elements, the at least two LED bar elements are arranged in a staggered manner, and each of the LED bar elements includes a plurality of LED bars arranged linearly on the circuit board. Each of the LED bars has a straight strip structure and has a plurality of LED dies of the same type provided inside. The plurality of LED dies is arranged linearly at equal intervals.

Abstract: A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrodes electrically connected to the first electrodes on the package surface layer, cutting the light-emitting diode chips, sorting and testing as well as regrouping the light-emitting diode chips, covering sides of the light-emitting diode chips with a package layer, drilling and filling a conductive material on the package layer to form a plurality of common electrodes, and then printing a plurality of common electrical circuits, electrically connecting each of the common electrical circuits to one of the common electrodes and the leading electrodes, and finally covering with a circuit protection layer to complete the process.

Abstract: A present invention includes at least two light cups and a composite material base. The composite material base comprises a first surface, a second surface and a third surface adjacent to the first surface, and a fourth surface opposite to the first surface. The at least two light cups are formed on the first surface. At least two first metal plates and at least two second metal plates having different polarities and corresponding to the quantity of the light cups are provided on the second surface. One ends of the at least two first and second metal plates individually pass through the composite material base and extend into the light cup to form two electrode contacts, and the other ends of the at least two first metal plates extend to the fourth surface to form an exposed heat dissipation structure.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.

Abstract: A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.

Abstract: The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.

Abstract: An optical assembly includes a light source for generating and emitting light, a light guide plate, and a light transmissive plate. The light transmissive plate is disposed above the light guide plate and has a plurality of asymmetric V-shaped structures on a bottom surface thereof. The V-shaped structures may divert the light emitted from an optical element to exit at a collimation angle, thereby enhancing a light utilization, reducing loss of the light, and facilitating the enhancement of a positive gray level. Further, the optical assembly has a simple structure and a low cost.

Abstract: A method for patterning a light guide plate includes: (a) using laser beams to carve out a plurality of notches on a mold; and (b) manufacturing the light guide plate with the mold for forming a plurality of laser process patterns on an incident plane of the light guide plate.

Abstract: Disclosed is a mobile handheld electronic apparatus with a light guide device, which includes: at least one user interface; at least one light-emitting device; and a light conducting device, for conducting the light from the light-emitting device to provide desired light to the user interface, wherein the light-emitting device is located between the user interface and the light conducting device, or the light-emitting device is located between the user interface and the light-emitting device. The light conducting device can further comprise: a first light conducting part, for providing desired light for the first user interface; and a second light conducting part, for providing desired light for the second user interface, wherein the first light conducting part and the second light conducting part are integral; and the light-emitting device is located at the border of the first light conducting part and the second light conducting part.

Abstract: A light device with a color mixing effect, includes a first light bar, a second light bar, and a holding structure. The first light bar emits a first color light with a first color, and the second light bar emits a second color light with a second color different from the first color. The holding structure, having a light-mixing area, includes a first positioning portion and a second positioning portion. The first positioning portion is for positioning the first light bar, the second positioning portion is for positioning the second light bar, and the first light bar is parallel to and obliquely faces the second light bar, such that the first color light and the second color light are respectively emitted into the light-mixing area to form a third color light with a third color different from the first color and the second color.