Abstract: A capacitor string structure, a memory device and a charge pump circuit thereof are provided. The capacitor string structure includes a plurality of conductive plates. The conductive plates are disposed in the memory device. The conductive plates are stacked to each other, and respectively form a plurality of word lines of the memory device, where two neighbored conductive plates form a capacitor.

Abstract: A capacitor string structure, a memory device and a charge pump circuit thereof are provided. The capacitor string structure includes a plurality of conductive plates. The conductive plates are disposed in the memory device. The conductive plates are stacked to each other, and respectively form a plurality of word lines of the memory device, where two neighbored conductive plates form a capacitor.

Abstract: In one aspect, a first charge pump has serially arranged charge pump stages. Inter-stage nodes between adjacent stages are pumped by a second charge pump. In another aspect, timing of the charge pump stages is controlled by at a command clock signal. The command clock signal and command data are communicated between a integrated circuit with the charge pump and an external circuit.

Abstract: In one aspect, a first charge pump has serially arranged charge pump stages. Inter-stage nodes between adjacent stages are pumped by a second charge pump. In another aspect, timing of the charge pump stages is controlled by at a command clock signal. The command clock signal and command data are communicated between a integrated circuit with the charge pump and an external circuit.

Abstract: A single-poly two-transistor PMOS memory cell for multiple-time programming applications includes a PMOS floating gate transistor sharing a drain/source P+ diffusion region with a PMOS select gate transistor all formed within a first n-well. A control plate for the floating gate transistor is formed in a second n-well. A single-poly two-transitor PMOS memory cell for one-time programming applications includes a PMOS floating gate transistor having a source formed as a p+ diffusion region in a single n-well. The source is adapted to also serve as control plate for the floating gate transistor.

Abstract: A single-poly two-transistor PMOS memory cell for multiple-time programming applications includes a PMOS floating gate transistor sharing a drain/source P+ diffusion region with a PMOS select gate transistor all formed within a first n-well. A control plate for the floating gate transistor is formed in a second n-well. A single-poly two-transitor PMOS memory cell for one-time programming applications includes a PMOS floating gate transistor having a source formed as a p+ diffusion region in a single n-well. The source is adapted to also serve as control plate for the floating gate transistor.

Abstract: A single-poly two-transistor PMOS memory cell for multiple-time programming applications includes a PMOS floating gate transistor sharing a drain/source P+ diffusion region with a PMOS select gate transistor all formed within a first n-well. A control plate for the floating gate transistor is formed in a second n-well. A single-poly two-transitor PMOS memory cell for one-time programming applications includes a PMOS floating gate transistor having a source formed as a p+ diffusion region in a single n-well. The source is adapted to also serve as control plate for the floating gate transistor.

Abstract: A single-poly two-transistor PMOS memory cell for multiple-time programming applications includes a PMOS floating gate transistor sharing a drain/source P+ diffusion region with a PMOS select gate transistor all formed within a first n-well. A control plate for the floating gate transistor is formed in a second n-well. A single-poly two-transitor PMOS memory cell for one-time programming applications includes a PMOS floating gate transistor having a source formed as a p+ diffusion region in a single n-well. The source is adapted to also serve as control plate for the floating gate transistor.

Abstract: A method and an integrated circuit for performing a soft program after erase provides efficient convergence of over-erased floating gate memory cells disposed in bit lines. The soft program is applied to successive subject bit lines. The BLISP method includes selection of a selected bit line and applying the soft program to a subject bit line corresponding to the selected bit line. For integrated circuits having no defective bit lines, the subject bit lines comprise the selected bit lines. The BLISP method is adapted for low current consumption compared to bulk soft programming methods. In some embodiments, the integrated circuit includes defective bit lines. For these integrated circuits, the selection of the selected bit line includes indicating a bit line type corresponding to the selected bit line. The defective bit lines are logically replaced by redundant bit lines so that the soft program is applied to conforming selected bit lines and redundant bit lines corresponding to defective bit lines.

Abstract: A circuit is provided for applying a negative voltage to the control gate of a floating gate memory cell and a positive voltage to the source drain or channel which comprises a positive voltage source to provide a positive voltage to the source of the cell, and a negative voltage source responsive to the supply voltage to provide a negative voltage to the control gate. A voltage regulator is included that is coupled to the negative voltage source and to the positive voltage source to maintain the negative voltage at a level responsive to the source voltage. The regulator maintains the negative voltage in response to the source voltage so that the electric field remains essentially constant over a range of values of source voltage.

Abstract: The present invention provides a new memory device for storage of boot code for microprocessors which boot to either the top or bottom of a memory map on power-up. The device includes a memory array, a first block, and decoders. The first block is defined as rows of the memory array designated for storage of data. The decoders decode a memory access requested for the data. The memory access request may be in either one of a top-down or bottom-up address protocol. In another embodiment, an integrated circuit memory includes: a memory array, a decoder, a control, and a logic gate. The decoders decode a memory access request to select a row of memory array. The control has an output for outputting either a bottom-up or a top-down address protocol signal. The logic gate outputs a logical "Exclusive Or" of the control signal and a corresponding bit of the memory access request, whereby a memory request in a bottom-up address protocol is converted to a memory address in a top-down address protocol.

Abstract: A method of manufacturing integrated circuits based on providing a test column of memory cells in the devices. Cells in the test column are selected by a portion of the addresses which identifies a row in the main array on the device. A test is executed to determine a characteristic of the device, and the results of that test are mapped to the portion of the address which identifies a row in the array. This produces a characteristic code address for the device which indicates the results of the test. Access to the test column on the device is enabled, and a bit is written in response to the characteristic code address in a memory cell on the test column. During manufacture the test column is read in order to classify the device according to the characteristic.

Abstract: A circuit generates a power on reset signal in response to the changing of a supply potential across a supply node and a reference node from a power down level to a power on level. The circuit comprises a capacitor having a first terminal coupled to the supply node and a second terminal. An output driver, such as an inverter, is coupled between the supply node and the reference node. The output driver has an output coupled to the second terminal of the capacitor. An input driver comprises a circuit which drives the input of the output driver to a level which tracks changes in the supply potential. A clamp transistor, such as a n-channel MOS transistor having a lower threshold than normal transistors in the circuit, is coupled between the input of the output driver and the supply potential. The clamp transistor clamps the input of the output driver to a driver ready level which is below the trip point of the output driver when the supply potential is at a power down level.

Abstract: The negative supply voltage used by the drivers during sector or chip level erase operations is decoded separately from the decoding of the inputs of the individual wordline drivers in a compact wordline driver and decoder system. An integrated circuit memory comprising an array of memory cells arranged in a plurality of segments, a set of wordlines is coupled to the memory cells in the array, and wordline driver circuitry coupled to the set of wordlines is provided. The wordline driver circuitry includes a first supply voltage source, a second supply voltage source, and a set of wordline drivers. The wordline drivers are coupled to the first and second supply voltage sources, and selectively drive wordlines in the set of wordlines with a wordline voltage from either the first supply voltage source or the second supply voltage source in response to address signals which identify the respective drivers. The second supply voltage source includes a set of supply voltage selectors.

Abstract: A recovery circuit for recovering the control gate and the channel well of a floating gate memory cell to a first recovery potential and a second recovery potential respectively after a program or erase process has been performed on the cell is provided. The floating gate memory cell may include the control gate coupled to a first node at a first program/erase potential, a floating gate, the channel well coupled to a second node at a second program/erase potential having a first conductivity type, and drain and source regions within the channel well having a second conductivity type different from the first. The recovery circuit includes control circuitry that provides a recovery control signal indicating when the program or erase process has been completed, and a coupling circuit that connects the control gate to the channel well in response to the recovery control signal.

Abstract: A new flash memory cell structure and operational bias is based on the use of a triple well flash memory cell which allows Fowler Nordheim (F-N) tunneling with lower absolute value bias potentials. Thus, the floating gate memory cell is made in a semiconductor substrate having a first conductivity type, such as p-type. A first well within the substrate by having a second conductivity type different than the first conductivity type is included. A second well within the first well is also included having the first conductivity type. A drain and a source are formed in the second well having the second conductivity type, and spaced away from one another to define a channel area between the drain and the source. A floating gate and control gate structure is included over the channel area.

Abstract: The negative supply voltage and isolation well bias used by the drivers during sector or chip level erase operations are decoded separately from each other and from the decoding of the inputs of the individual wordline drivers in a compact wordline driver and decoder system. An integrated circuit memory comprising an array of memory cells arranged in a plurality of segments, a set of wordlines is coupled to the memory cells in the array, and wordline driver circuitry using shared isolation well MOS transistors coupled to the set of wordlines is provided. The wordline driver circuitry includes a first supply voltage source, a second supply voltage source, a third supply voltage source for the shared isolation well and a set of wordline drivers.

Abstract: A new flash memory cell structure and operational bias is based on the use of a triple well flash memory cell which allows pre-programming by Fowler Nordheim (F-N) tunneling over blocks of cells at a time. The floating gate memory cell is made in a semiconductor substrate having a first conductivity type, such as p-type. A first well within the substrate by having a second conductivity type different than the first conductivity type is included. A second well within the first well is also included having the first conductivity type. A drain and a source are formed in the second well having the second conductivity type, and spaced away from one another to define a channel area between the drain and the source. A floating gate and control gate structure is included over the channel area.

Abstract: A circuit is provided for supplying a negative erasing voltage onto the wordlines of selected blocks in an array of floating gate memory cells. The circuit includes a voltage circuit, which has a plurality of local outputs, each of which connects to wordlines of an associated block of floating gate memory cells. A block selector circuit is coupled to the local outputs of the voltage circuit and selectively switches each of the local outputs to apply either an erasing voltage or a non-erasing voltage onto the wordlines of the associated block of floating gate memory cells. Negative wordline stress is thus reduced for wordlines of unselected blocks which receive a less negative, non-erasing voltage during block erase operations.

Abstract: A flash memory device includes a multiple checkpoint erase suspend algorithm. A user may issue an erase suspend command at anytime during an erase process. The erase procedure is suspended as fast as possible by allowing the erase procedure to be suspended at the first to occur of a plurality of checkpoints in the process. The block erase procedure includes a precondition phase (also called a pre-programming phase), in which a selected block is pre-programmed by applying a program potential, and then the pre-programming of the block is verified on a byte-by-byte basis. After the precondition phase, an erase phase is executed in which the selected block is erased by applying an erase potential to the block, and then verifying the erasing of the block. Erase suspend logic is coupled to the erase logic and executes an erase suspend procedure which interrupts the block erase procedure after receiving the erase suspend command during the first to occur of a set of checkpoints in the block erase procedure.