Abstract: In accordance with the objectives of the invention a new method and structure is provided for the creation of multiple overlying layers of interconnect metal. A channel is reserved for the creation of via interconnects, no vias are placed on metal lines. The metal lines are stacked and parallel, whereby a space is provided between lines that is reserved for the creation of vias for layer interconnection. This structure can be repeated, the vias are placed on the therefore reserved channel, interconnections are provided to the interconnect traces.

Abstract: In accordance with the objectives of the invention a new method and structure is provided for the creation of multiple overlying layers of interconnect metal. A channel is reserved for the creation of via interconnects, no vias are placed on metal lines. The metal lines are stacked and parallel, whereby a space is provided between lines that is reserved for the creation of vias for layer interconnection. This structure can be repeated, the vias are placed on the therefore reserved channel, interconnections are provided to the interconnect traces.

Abstract: In accordance with the objectives of the invention a new method and structure is provided for the creation of multiple overlying layers of interconnect metal. A channel is reserved for the creation of via interconnects, no vias are placed on metal lines. The metal lines are stacked and parallel, whereby a space is provided between lines that is reserved for the creation of vias for layer interconnection. This structure can be repeated, the vias are placed on the therefore reserved channel, interconnections are provided to the interconnect traces.

Abstract: In accordance with the objectives of the invention a new method and structure is provided for the creation of multiple overlying layers of interconnect metal. A channel is reserved for the creation of via interconnects, no vias are placed on metal lines. The metal lines are stacked and parallel, whereby a space is provided between lines that is reserved for the creation of vias for layer interconnection. This structure can be repeated, the vias are placed on the therefore reserved channel, interconnections are provided to the interconnect traces.

Abstract: A first mask includes a plurality of vertical portions and a plurality of horizontal portions. The vertical portions and the horizontal portion are crossed, thereby forming a plurality of closed areas. A second mask is placed over the first mask that exposes the closed areas for forming sources and drains. A third mask formed over the closed areas to expose a portion of the closed areas for forming contact holes, and a fourth mask includes a first portion and a second separated portion, the first portion and the separated second portion cover the first contact holes.

Abstract: A first mask includes a well mask formed over a first portion of the wafer to define a first conductive type well in the wafer. A first polysilicon mask is formed over the well mask including a plurality of first structures and a plurality of second structures to cover a first polysilicon layer, thereby defining polysilicon gates. A first implanting mask is formed over the first polysilicon mask for forming second conductive type region. A second implanting mask is formed over the first polysilicon mask for forming first conductive type region. A second polysilicon mask is formed between gates of a second conductive type MOS and gates of a first conductive type MOS. A contact hole mask is formed over the second polysilicon mask for forming contact holes. A metal mask is formed over the contact hole mask for forming connection.