Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.

Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.

Abstract: Disclosed herein are suspension assembly structures for data storage devices that include physical or virtual crossovers of the pairs of differential signal traces to improve immunity to crosstalk and other interference. In an embodiment, the suspension assembly structure comprises a first trace for carrying a first component of a current to a differential transducer on a slider, a second trace for carrying a second component of the current to the differential transducer on the slider, and third and fourth traces for providing a differential write current to a writer of the data storage device, wherein the first trace physically crosses over the second trace at a first distance from a tail of the suspension assembly structure.

Abstract: Disclosed herein are suspension assembly structures for data storage devices that include physical or virtual crossovers of the pairs of differential signal traces to improve immunity to crosstalk and other interference. In an embodiment, the suspension assembly structure comprises a first trace for carrying a first component of a current to a differential transducer on a slider, a second trace for carrying a second component of the current to the differential transducer on the slider, and third and fourth traces for providing a differential write current to a writer of the data storage device, wherein the first trace physically crosses over the second trace at a first distance from a tail of the suspension assembly structure.

Abstract: A method for head stack assembly (HSA) rework is disclosed. A first head gimbal assembly (HGA) includes a first suspension attached to an arm of the HSA, and a first flexure tail that terminates in a first bonding region that is bonded to a flexible printed circuit (FPC) of the HSA. The first HGA is removed by cutting the first bonding region from a remainder of the first flexure tail and detaching the first suspension from the arm. The first bonding region of the first flexure tail is left bonded to the FPC. A replacement HGA includes a replacement suspension and a replacement flexure tail that terminates in a second bonding region. The replacement HGA is installed on the HSA by attaching the replacement suspension to the arm, overlaying the second bonding region on the first bonding region, and bonding the second bonding region to the first bonding region.

Abstract: A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.

Abstract: A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.

Abstract: A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.

Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.

Abstract: A flexure tail of a head suspension assembly includes a structural layer, a conductive layer, a dielectric layer between the structural and conductive layers, and an insulative cover layer disposed on the conductive layer. The conductive layer includes a plurality of flexure bond pads in a terminal region of the flexure tail. The insulative cover layer includes a plurality of openings that expose each of the plurality of flexure bond pads. The dielectric layer defines a first thickness between the structural layer and the conductive layer at each of the plurality of flexure bond pads. The dielectric layer also defines a second thickness between the structural layer and the conductive layer adjacent to the plurality of flexure bond pads in the terminal region of the flexure tail. The second thickness is less than the first thickness by a thickness difference that is no less than a cover layer thickness.

Abstract: A head stack assembly (HSA) includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth is bisected by a mouth centerline that is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A head gimbal assembly (HGA) is attached to each of the first and second actuator arms. Each HGA includes a flexure tail laminate having a dielectric layer disposed between a plurality of conductive traces and a structural layer. The plurality of conductive traces is electrically connected to either the first or second plurality of conductive terminals via a plurality of openings in the structural layer and in the dielectric layer.

Abstract: Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.

Abstract: A method for manufacturing a magnetic recording head slider is disclosed. A plurality of bond pads are formed in a linear arrangement adjacent one another on a trailing edge of a slider body. Each of the plurality of bond pads comprises a probe contact area and a soldering contact area with each area being laterally bounded in a width dimension, along the trailing edge, by respective edges of the pads wherein a width of the probe contact area is greater than a width of the soldering contact area of each respective pad whereby the probe contact area is larger than the soldering contact area.

Abstract: A novel head stack assembly (HSA) is disclosed and claimed. The HSA includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth defines and is bisected by a mouth centerline disposed equidistant from the upper mouth edge and the lower mouth edge. The mouth centerline is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A first plurality of conductive traces of a first head gimbal assembly (HGA) is electrically connected to the first plurality of conductive terminals, and a second plurality of conductive traces of a second HGA is electrically connected to the second plurality of conductive terminals.

Abstract: A head stack assembly (HSA) includes a flexible printed circuit (FPC) having a mouth with an upper mouth edge and a lower mouth edge. The FPC includes a first plurality of conductive terminals immediately adjacent the upper mouth edge and a second plurality of conductive terminals immediately adjacent the lower mouth edge. The mouth is bisected by a mouth centerline that is substantially parallel to and substantially equidistant from first and second actuator arms of the HSA. A head gimbal assembly (HGA) is attached to each of the first and second actuator arms. Each HGA includes a flexure tail laminate having a dielectric layer disposed between a plurality of conductive traces and a structural layer. The plurality of conductive traces is electrically connected to either the first or second plurality of conductive terminals via a plurality of openings in the structural layer and in the dielectric layer.

Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.

Abstract: A method to manufacture a head stack assembly for a disk drive, the method comprising: attaching a head gimbal assembly that includes a flexure tail having flexure bond pads to an actuator that includes a flexible printed circuit (FPC) with FPC bond pads; folding each of the flexure bond pads upon itself such that the flexure tail is substantially thicker at each of the folded flexure bond pads; aligning the flexure bond pads with the FPC bond pads; introducing an adhesive material that includes electrically conductive beads of substantially similar size between each of the flexure bond pads and corresponding ones of the FPC bond pads; and bringing a thermode tool into contact with the flexure bond pads after folding, with the thermode tool pressing the flexure bond pads against the FPC bond pads for a period.

Abstract: A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.

Abstract: A head gimbal assembly for a disk drive includes a flexure tail terminal region having flexure bond pads in electrical communication with the head. Each of the flexure bond pads includes a widened region of a corresponding one of a plurality of electrical traces in a conductive layer, and a discontinuous bond pad backing island in a structural layer that overlaps the widened region. The flexure tail terminal region also includes a plurality of discontinuous edge stiffener islands in the structural layer that do not overlap the widened region of any flexure bond pad, and that are disposed no more than 50 microns from one of the two opposing longitudinal outer edges of the flexure tail terminal region. At least one of the plurality of discontinuous bond pad backing islands is disposed no more than 50 microns from one of the two opposing longitudinal outer edges.

Abstract: A disk drive suspension assembly has a load beam and a laminated flexure attached to the load beam. The laminated flexure includes a structural layer with a head mounting tongue, and first and second conductive layers. A first dielectric layer is disposed between the structural layer and the first conductive layer, and a second dielectric layer is disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first plurality of adjacent traces, and the second conductive layer includes a second plurality of adjacent traces that are staggered relative to the first plurality of adjacent traces. The adjacent traces of each plurality are electrically common and joined at a distal junction adjacent the head mounting tongue and joined at a proximal junction at the flexure tail terminal region.