Patents by Inventor Tzrong-Li Han

Tzrong-Li Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
    Publication number: 20080061425
    Abstract: A chip package structure comprising a chip, a packaging cover panel and an adhesion layer is provided. The chip has an active surface. An image-sensing device is disposed on the active surface and a plurality of contact pads is disposed around the image-sensing device. The package cover panel is disposed over the active surface. The package cover panel includes a substrate and a supporting part disposed on the substrate such that the supporting part defines a cavity on the substrate. The supporting part may contact with the active surface of the chip so that the image-sensing device on the active surface is located within the cavity. The adhesion layer is disposed between the supporting part and the active surface.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 13, 2008
    Applicant: UNITED MICRODISPLAY OPTRONICS CORP.
    Inventors: Da-Shuang Kuan, Tony Whitehead, Tzrong-Li Han