Abstract: An organic electroluminescent material of the formula: wherein M is at least one selected from the group consisting of —CH2—, —CH2CH2—, —CH2CH2CH2—, —CH2C(CH3)2CH2—, and —CH2YCH2—, X is at least one selected from the group consisting of oxygen, sulfur, nitrogen, carbon, alkyl, silicon, silyl, phosphorus, aryl, and polyaryl, and n is depending on the amount of free radicals of X. Y is at least one selected from the group consisting of oxygen, sulfur, nitrogen and SiR1R2. Wherein, R1 and R2 is at least one selected from the group consisting of substituted or unsubstituted alkyl having 1 to 10 carbon atoms, and substituted or unsubstituted aryl having 6 to 30 carbon atoms. This invention also discloses an organic electroluminescent element having the organic electroluminescent material.

Abstract: A device for accommodating a tablet computer includes a first sidewall plate and a second sidewall plate that is disposed corresponding to the first sidewall plate. The first sidewall plate and second sidewall plate define a space for accommodating the tablet computer. A supporting mechanism comprises a first pivot piece and a second pivot piece, both of which having one end being pivotally installed at an inner side of the first sidewall plate. The first pivot piece and second pivot piece rotate between a close position and an angled use position with respect to the first sidewall plate. When the first pivot piece and second pivot piece are in the angled use position, the second pivot piece is supported and positioned by the first pivot piece so that the second pivot piece can support the tablet PC.

Abstract: An improved shoelace structure is made up of a belt-like shoelace having two narrowed leading ends bound at both ends thereon to be led through buttonholes of a shoe body thereby wherein between both narrowed leading ends thereof are disposed a tying section to be tied up at the upper surface of the shoe body thereof and a passage section to be wound through the buttonholes of the shoe body thereby. Both the tying section and the passage section are integrally woven to form a plurality of bulge parts and narrowed parts that are alternatively arranged with each adjacent to others in a sequence. The bulge parts of the tying section and the passage section thereof can be made into a wide flatness or a protruded arc shape thereof, and the narrowed parts thereof can be formed into a straight flatness or a round straight column thereof.

Abstract: The piston of a fluid motor divides the cylinder into two variable volumes into which and from which fluid may be selectively introduced and exhausted via ports through the cylinder to relatively move the piston and the cylinder. The piston is modified to define two fixed-volume chambers that respectively communicate with the variable volumes via restrictive orifices. In selected relative piston-cylinder positions, the chambers communicate with the ports to restrict fluid flow into and out of the variable volumes and to decrease the velocity of relative piston-cylinder movement. In other relative piston-cylinder positions, the chambers do not communicate with the ports and fluid enters and leaves the variable volumes directly through the ports to relatively move the piston-cylinder at a higher velocity.

Abstract: A mask with a three-dimensional structure provides a one-piece structure with an upper portion, the middle portion, and a lower portion. A molded notch is located at both nasal bridge of the upper portion and chin of the lower portion. The upper portion and lower portion are reversely folded so as to form a pleat for supporting the middle portion as a three-dimensional structure mask. The three-dimensional structure mask meets the facial configuration design for accommodating to different facial shapes. Furthermore, the mask with a three-dimensional structure has a normal range of elasticity to conform to certain facial contours, therefore, decreases leakage occurrence, and increases filtration rate in a high pollution environment. More, the upper portion and the lower portion of the mask are folded in a reverse direction for avoiding a contacting pollution from touching the inner surface.

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

Abstract: An organic electroluminescent material of the formula: 1

Abstract: A device for accommodating a tablet computer includes a first sidewall plate and a second sidewall plate that is disposed corresponding to the first sidewall plate. The first sidewall plate and second sidewall plate define a space for accommodating the tablet computer. A supporting mechanism comprises a first pivot piece and a second pivot piece, both of which having one end being pivotally installed at an inner side of the first sidewall plate. The first pivot piece and second pivot piece rotate between a close position and an angled use position with respect to the first sidewall plate. When the first pivot piece and second pivot piece are in the angled use position, the second pivot piece is supported and positioned by the first pivot piece so that the second pivot piece can support the tablet PC.

Abstract: A blood collection set comprises essentially a syringe, a syringe cover, a flexible tube and a test tube, wherein on the top of said syringe body, there is provided protrudingly with one or more fasteners; and wherein, on the syringe cover, there are provided with several gliding slots corresponding to the number and positions of said fasteners on said syringe, wherein, on both of the front and rear ends of said gliding slots, a protruding button is provided convex in a manner that a fastening portion is formed on the front end and the rear end of said gliding slots, respectively, and wherein the base of the syringe cover is flat and is engaged with said lateral pieces of the syringe; wherein the front end of the flexible tube is connected with the rear end of the syringe, while a plastic needle is provided on the rear end of said flexible tube; and wherein an interposing structure is provided by sleeving on said flexible tube.

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Abstract: An optical detection and measurement system for selectively detecting the plane of the reflective surfaces of a workpiece. A laser source provides a low power, single wavelength collimated beam of light which is directed onto a workpiece. The beam is passed through a converging lens to a reflected focus on a quad detector. The light beams reflected from the workpiece pass through a diverging lens to the quad detector. The non-diverging optical axis center of the diverging lens is aligned with the center of the quad detector so that a reflected beam passing through the non-diverging optical axis center of the diverging lens creates equal photocurrent outputs from each of the four photosensitive elements of the quad detector to produce a null condition. Where the workpiece is made up of translucent or transparent layers which produce multiple reflected beams, reflected beams from surfaces other than the surface of interest are deflected away from the active surface of the quad detector by the diverging lens.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.

Abstract: An improved control mechanism for use in a magnetically operated wheel. The mechanism includes an outer cover, an inner housing, a pair of compression springs, two small supporting wheels, two linkage pieces, an externally connected pull cord control mount, a sensor, a signal transmitter mount and an internal or external transmission set. In adjustment, only a motor is activated to make a main transmission device, a secondary transmission device, a driven gear, a restraint unit and a driving wheel rotate in synchronism. When the driving wheel rotates, a lower gear and the linkage rack of the two pivotal linkage pieces equipped with a plurality of magnets and housed in a flywheel are in mesh engagement with each other to vary the distance between the magnets and the flywheel so as to make the adjustment of braking resistance of the flywheel in a stageless manner.