Abstract: In one embodiment, the present invention is directed to a method implemented on a computer system of database retrieval including organizing and suggesting search results by style, not just product category. In one embodiment, a computer implemented smoothing algorithm is used to adjust the ranking feature calculations from insufficient data. The use of smoothing improves the statistical confidence of the ranking features, creating a product ranking that is robust to small sample bias.

Abstract: A method comprises embedding a semiconductor structure in a molding compound layer, depositing a plurality of photo-sensitive material layers over the molding compound layer, developing the plurality of photo-sensitive material layers to form a plurality of openings, wherein a first portion and a second portion of an opening of the plurality of openings are formed in different photo-sensitive material layers and filling the first portion and the second portion of the opening with a conductive material to form a first via in the first portion and a first redistribution layer in the second portion.

Abstract: Methods and semiconductor structures are provided. A method according to the present disclosure includes receiving a workpiece that includes a first gate structure disposed over a first active region, a second gate structure disposed over a second active region, a first gate spacer extending along a sidewall of the first gate structure and disposed at least partially over a top surface of the first active region, a second gate spacer extending along a sidewall of the second gate structure and disposed at least partially over a top surface of the second active region, and a source/drain feature. The method also includes treating a portion of the first gate spacer and a portion of the second gate spacer with a remote radical of hydrogen or oxygen, removing the treated portions, and after the removal, depositing a metal fill material over the source/drain feature.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes loading a first wafer and a second wafer onto a bonding platform such that the second wafer overlies the first wafer. An alignment process is performed to align the second wafer over the first wafer by virtue of a plurality of wafer pins, where a plurality of first parameters are associated with the wafer pins during the alignment process. The second wafer is bonded to the first wafer. An overlay (OVL) measurement process is performed on the first wafer and the second wafer by virtue of the plurality of wafer pins, where a plurality of second parameters are associated with the wafer pins during the alignment process.

Abstract: An analog front-end (AFE) circuit, configured to be coupled to a sensor having a plurality of sensing units, includes a plurality of sensing circuits and a plurality of multiplexers. Each of the plurality of multiplexers is coupled between one of the plurality of sensing units and at least two of the plurality of sensing circuits.

Abstract: A mold for manufacturing an artificial shuttlecock from a semi-finished shuttlecock includes a male mold and a female mold. The male mold includes a cone frustum and a plurality of first annular grooves. The semi-finished shuttlecock is placed on an outside of the cone frustum. The first annular grooves are disposed apart on the outside of the cone frustum. The female mold includes a tapered slot, a plurality of second annular grooves and an injection channel. The second annular grooves are disposed apart on an inner surface of the tapered slot. When the semi-finished shuttlecock and the male mold are placed into the female mold, each of the first annular grooves corresponds to each of the second annular grooves to form a plurality of molded grooves. The injection channel communicates with the second annular grooves, and the molded grooves communicate with the injection channel through the second annular grooves.

Abstract: A display panel includes a first substrate, a second substrate, a liquid crystal layer, a pixel electrode, a common electrode, a first polarizer and a second polarizer. The pixel electrode includes a trunk portion, first to fourth branch portions, and first to fourth strip portions. The trunk portion extends along a first direction. The first and second branch portions are connected to a first end of the trunk portion. The third and fourth branch portions are connected to a second end of the trunk portion. The first strip portions are connected to the first and second branch portions. The second strip portions are connected to the third and fourth branch portions. The third strip portions are connected to the first and third branch portions and the trunk portion. The fourth strip portions are connected to the second and fourth branch portions and the trunk portion.

Abstract: A device mounting system includes a device bracket coupled to a device, and a support surface mount coupled to the device bracket. The support surface mount includes a base member mounted to a support surface, a securing member extending from the base member, and a securing latch that is included in the securing member and that moves between a secured orientation in which it engages the device bracket to secure the device bracket to the support surface mount, and an unsecured orientation that allows the device bracket to be decoupled from the support surface mount. A release member in the securing member may be actuated to move the securing latch between the secured and unsecured orientations. A locking element in the securing member may be actuated to prevent movement of the securing latch from the secured to the unsecured orientation to lock the device bracket to the support surface mount.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes loading a first wafer and a second wafer onto a bonding platform such that the second wafer overlies the first wafer. An alignment process is performed to align the second wafer over the first wafer by virtue of a plurality of wafer pins, where a plurality of first parameters are associated with the wafer pins during the alignment process. The second wafer is bonded to the first wafer. An overlay (OVL) measurement process is performed on the first wafer and the second wafer by virtue of the plurality of wafer pins, where a plurality of second parameters are associated with the wafer pins during the alignment process.

Abstract: Described are a height adjust stand (HAS) for a display and an all in one computing device. The HAS includes a base. A riser assembly connects to the base, and angled greater than 90 degrees from vertical of the HAS. A lift plate in the riser assembly that includes an arm, the arm angled greater than 90 degrees from vertical of the HAS. The lift plate provides vertical travel for the display. A VESA assembly includes a mating component that fits into the opening of the arm. The VESA assembly including an internal hinge that provides tilt for the display. In an all in one computing device, a computing cartridge assembly is snapped into the back of the riser assembly.

Abstract: Disclosed herein is a building assembly for assembling building panels. The building assembly includes a supporting member, a pair of a first sealing member, an elastically deformable gasket, and a second sealing member. The supporting member has a base, a channel disposed at the center of the base, and a pair of rails independently disposed next to the channel. The pair of a first sealing members independently includes a first base portion and two retention tongues independently extending outwardly from the first base portion. The elastically deformable gasket has a U- or V-shaped space in cross section and two flanges independently extending laterally from one edge of the U- or V-shaped space. The second sealing member has a second base portion and a rib disposed at the center of the second base portion.

Abstract: A cartridge-based computing system includes a display stand that connects to a compute module cartridge including a first securing member, a second securing member, and a release member coupled to the second securing member. The display stand defines a securing aperture that engages the first securing member when the compute module cartridge is connected to the display stand, which causes the first securing member to engage a securing element on the display stand and move it into engagement with the second securing member to connect the compute module cartridge to the display stand. The securing element may then be engaged by the release member to move it out of engagement with the second securing member, and into engagement with the first securing member to cause the securing aperture to disengage the first securing member and disconnect the compute module cartridge from the display stand.

Abstract: A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

Abstract: A portable electronic device includes a first body, a second body, a hinge mechanism, a spring, and a cable extending from the first body to the second body. The second body is connected to the first body through the hinge mechanism. The first body has a first pillar, a second pillar, and a third pillar. The second pillar is located between the first pillar and the third pillar. The spring is disposed in the first body as corresponding to the second pillar. The cable includes a first winding segment extending through a gap between the first pillar and the second pillar, a second winding segment extending through a gap between the second pillar and the spring, and a third winding segment extending through a gap between the second pillar and the third pillar. Two ends of the spring are respectively connected to the first body and the second winding segment.

Abstract: A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer.

Abstract: A method for manufacturing a semiconductor structure with power connecting structures under transistors comprises: forming a stop layer structure in a semiconductor substrate to divide the semiconductor substrate into a first substrate part and a second substrate part; forming a plurality of stop portions in the first substrate part and in proximity to an active surface; arranging the transistor elements on the active surface, the contact portions of the transistor elements corresponding to the stop portions; removing the second substrate part and the stop layer structure; forming a first patterned mask layer with first patterned openings on a bottom surface of the first substrate part, the first patterned openings corresponding to the stop portions; forming through open slots in the first substrate part and exposing the contact portions via the open slots; forming a protecting layer to cover side walls of the open slots; forming a conductive layer to cover the contacts; and forming the power connecting struc

Abstract: A method of manufacturing a three-dimensional system-on-chip, comprising providing a memory wafer structure with a first redistribution layer; disposing a first conductive structure and a core die structure and an input/output die structure with a second conductive structure on the first redistribution layer, the input/output die structure being disposed around the core die structure; forming a dielectric layer covering the core die structure, the input/output die structure, and the first conductive structure; removing a part of the dielectric layer and thinning the core die structure and a plurality of input/output die structures to expose the first and second conductive structures; forming a third redistribution layer on the dielectric layer, the third redistribution layer being electrically connected to the first and second conductive structures; forming a plurality of solder balls on the third redistribution layer; performing die saw. A three-dimensional system-on-chip is further provided.

Abstract: A cartridge-based computing system includes a display stand that connects to a compute module cartridge including a first securing member, a second securing member, and a release member coupled to the second securing member. The display stand defines a securing aperture that engages the first securing member when the compute module cartridge is connected to the display stand, which causes the first securing member to engage a securing element on the display stand and move it into engagement with the second securing member to connect the compute module cartridge to the display stand. The securing element may then be engaged by the release member to move it out of engagement with the second securing member, and into engagement with the first securing member to cause the securing aperture to disengage the first securing member and disconnect the compute module cartridge from the display stand.

Abstract: A portable electronic device includes a first body, a second body, a hinge mechanism, a spring, and a cable extending from the first body to the second body. The second body is connected to the first body through the hinge mechanism. The first body has a first pillar, a second pillar, and a third pillar. The second pillar is located between the first pillar and the third pillar. The spring is disposed in the first body as corresponding to the second pillar. The cable includes a first winding segment extending through a gap between the first pillar and the second pillar, a second winding segment extending through a gap between the second pillar and the spring, and a third winding segment extending through a gap between the second pillar and the third pillar. Two ends of the spring are respectively connected to the first body and the second winding segment.