Patents by Inventor Tzu Cheng Lin

Tzu Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250123572
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and machine learning are used to train a classification that correlates the overlay error source factors with overlay metrology categories. The overlay error source factors include tool signals. The trained classification includes a base classification and a Meta classification.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 17, 2025
    Inventors: Tzu-Cheng LIN, Chien Rhone WANG, Kewei ZUO, Ming-Tan LEE, Zi-Jheng LIU
  • Publication number: 20250087592
    Abstract: A package structure includes a first bonding film on a first package component and a first alignment mark in the first bonding film. The first alignment mark includes a plurality of first patterns spaced apart from each other. The package structure includes a second bonding film on a second package component and bonded to the first bonding film, and a second alignment mark in the second bonding film. The second alignment mark includes a plurality of second patterns spaced apart from each other, and the first patterns overlap the second patterns. In this case, an interference pattern can be formed by the optical signal passing through the varying spacing between the gratings of top wafer and bottom wafer due to pitch difference between first pitch and second pitch. By reading the optical signal, the resolution of overlay (misalignment) measurement is improved.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Geng-Ming CHANG, Kewei ZUO, Tzu-Cheng LIN, Chih-Hang TUNG, Wen-Chih CHIOU, Wen-Yao CHANG, Chen-Hua YU
  • Patent number: 12237188
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Kewei Zuo, Chien Rhone Wang
  • Patent number: 12197138
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and machine learning are used to train a classification that correlates the overlay error source factors with overlay metrology categories. The overlay error source factors include tool signals. The trained classification includes a base classification and a Meta classification.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: January 14, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Cheng Lin, Chien Rhone Wang, Kewei Zuo, Ming-Tan Lee, Zi-Jheng Liu
  • Patent number: 12176297
    Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: December 24, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hao-Chih Hsieh, Tzu-Cheng Lin, Chun-Jen Chen
  • Publication number: 20240387447
    Abstract: A method for forming a semiconductor device is provided. The method includes forming first bonding features and a first alignment mark including first patterns in a top die and forming second bonding features and a second alignment mark in a bottom wafer. The method also includes determining a first benchmark and a second benchmark. The method further includes aligning the top die with the bottom wafer using the first alignment mark and the second alignment mark. In a top view, at least two of the first patterns are oriented along a first direction, and at least two of the first patterns are oriented along a second direction that is different from the first direction. The top die is aligned with the bottom wafer by adjusting a virtual axis passing through the first benchmark and the second benchmark to be substantially parallel with the first direction.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Geng-Ming CHANG, Chih-Hang TUNG, Chen-Hua YU, Kuo-Chung Yee, Kewei ZUO, Shou-Yi Wang, Tzu-Cheng LIN, Shih-Wei LIANG
  • Publication number: 20230223287
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Inventors: Tzu-Cheng LIN, Y.Y. PENG, Jerry WANG, Kewei ZUO, Chien Rhone WANG
  • Patent number: 11626304
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: April 11, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Kewei Zuo, Chien Rhone Wang
  • Publication number: 20220269184
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and machine learning are used to train a classification that correlates the overlay error source factors with overlay metrology categories. The overlay error source factors include tool signals. The trained classification includes a base classification and a Meta classification.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Inventors: Tzu-Cheng LIN, Chien Rhone WANG, Kewei ZUO, Ming-Tan LEE, Zi-Jheng LIU
  • Publication number: 20220238457
    Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hao-Chih HSIEH, Tzu-Cheng LIN, Chun-Jen CHEN
  • Patent number: 11302646
    Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hao-Chih Hsieh, Tzu-Cheng Lin, Chun-Jen Chen
  • Publication number: 20210257311
    Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 19, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hao-Chih HSIEH, Tzu-Cheng LIN, Chun-Jen CHEN
  • Publication number: 20210175105
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 10, 2021
    Inventors: Tzu-Cheng LIN, Y.Y. PENG, Jerry WANG, Kewei ZUO, Chien Rhone WANG
  • Patent number: 10964566
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Go., Ltd.
    Inventors: Tzu-Cheng Lin, Y.Y. Peng, Jerry Wang, Kewei Zuo, Chien Rhone Wang
  • Publication number: 20200006102
    Abstract: The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
    Type: Application
    Filed: May 7, 2019
    Publication date: January 2, 2020
    Inventors: Tzu-Cheng Lin, Y.Y. Peng, Jerry Wang, Kewei Zuo, Chien Rhone Wang
  • Patent number: 9390491
    Abstract: A system and method is disclosed for a quality control and/or inspection procedure for assembly line processes. The disclosed system and method enable automatic optical inspection of a device during different stages of manufacture as well as in its finished form. The disclosed system and method enable the automatic quality control process to be self-learning, dynamic, and to identify and classify defects in real time.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: July 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kewei Zuo, Chien Rhone Wang, Tzu-Cheng Lin, Chih-Wei Lai
  • Patent number: 8964394
    Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: February 24, 2015
    Assignee: Moxa Inc.
    Inventors: Tzu Cheng Lin, Wei Cheng Chou
  • Patent number: 8640968
    Abstract: This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: February 4, 2014
    Assignee: Moxa Inc.
    Inventors: Tzu Cheng Lin, Yu Kuang Lee, Wei Cheng Chou, Hsin Ju Wu
  • Publication number: 20140016261
    Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 16, 2014
    Applicant: MOXA INC.
    Inventors: Tzu Cheng Lin, Wei Cheng Chou
  • Patent number: 8445296
    Abstract: Methods and apparatus for performing end point determination. A method includes receiving a wafer into an etch tool chamber for performing an RIE etch; beginning the RIE etch to form vias in the wafer; receiving in-situ measurements of one or more physical parameters of the etch tool chamber that are correlated to the RIE etch process; providing a virtual metrology model for the RIE etch in the chamber; inputting the received in-situ measurements to the virtual metrology model for the RIE etch in the chamber; executing the virtual metrology model to estimate the current via depth; comparing the estimated current via depth to a target depth; and when the comparing indicates the current via depth is within a predetermined threshold of the target depth; outputting a stop signal. An apparatus for use with the method embodiment is disclosed.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: May 21, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Rhone Wang, Tzu-Cheng Lin, Yu-Jen Cheng, Chih-Wei Lai, Hung-Pin Chang, Tsang-Jiuh Wu