Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: An electronic device is provided. The electronic device comprises a display unit and a processing unit. The processing unit is electrically connected to the display unit and is configured to perform steps including: obtaining signal strength of connections between a plurality of nodes; and controlling the display unit to display the connections graphically according to the signal strength. An operation method adapted to an electronic device, and a non-transitory computer readable storage medium is also provided.

Abstract: An electronic device is provided. The electronic device comprises a display unit and a processing unit. The processing unit is electrically connected to the display unit and is configured to perform steps including: obtaining signal strength of connections between a plurality of nodes; and controlling the display unit to display the connections graphically according to the signal strength. An operation method adapted to an electronic device, and a non-transitory computer readable storage medium is also provided.