Patents by Inventor Tzu-Chiang Wang

Tzu-Chiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929425
    Abstract: The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung Wang, Chao-Ching Cheng, Tzu-Chiang Chen, Tung Ying Lee
  • Publication number: 20240068516
    Abstract: A slide rail assembly includes a first rail, a second rail, a slide assisting device, an elastic member and a working member. The second rail and the first rail are movable relative to each other. The elastic member is arranged on the second rail. During a process of the second rail being moved relative to the first rail along an opening direction, the working member is configured to contact the elastic member in an initial state in order to drive the slide assisting device to move along the opening direction to a predetermined position. When the slide assisting device is located at the predetermined position, the elastic member releases an elastic force through a predetermined space of the first rail, such that the elastic member is no longer in the initial state with the working member no longer contacting the elastic member.
    Type: Application
    Filed: January 11, 2023
    Publication date: February 29, 2024
    Inventors: Ken-Ching Chen, Shun-Ho Yang, Tzu-Cheng Weng, Chun-Chiang Wang
  • Publication number: 20240065438
    Abstract: A slide rail assembly is provided and includes a first rail, a second rail movable with respect to the first rail, a working member, an operating member and a blocking member. When the second rail is located at an extended position with respect to the first rail and the working member is in a first state, the working member and a blocking feature of the first rail block each other for restraining the second rail from moving toward a first predetermined direction from the extended position. The blocking member is switchable between a blocking state and a non-blocking state for restraining the operating member from driving the working member to disengage from the first state or for allowing the operating member to drive the working member from the first state to a second state. Besides, a related slide rail kit is also provided.
    Type: Application
    Filed: December 19, 2022
    Publication date: February 29, 2024
    Applicants: KING SLIDE WORKS CO., LTD., KING SLIDE TECHNOLOGY CO.,LTD.
    Inventors: Ken-Ching Chen, Shun-Ho Yang, Tzu-Cheng Weng, Chun-Chiang Wang
  • Patent number: 11205308
    Abstract: A method and an electronic apparatus of modifying a three-dimensional model are provided. In the method, multiple two-dimensional images are obtained by scanning a real environment Real objects of the real environment are identified in the two-dimensional images. A three-dimensional model is generated based on the two-dimensional images. The three-dimensional model is related to the depth information of the real objects. A modifying operation for modifying one or more virtual objects in the three-dimensional model is received. The virtual objects are corresponding to one or more real objects. The modifying operation is mapped into the two-dimensional images based on the identified result of the real objects in the two-dimensional image and the depth information of the real objects, to generate a modified image. A modified three-dimensional model is generated based on the modified image, to provide a proper modified result.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 21, 2021
    Assignee: XRSPACE CO., LTD.
    Inventors: Wei-Ting Chen, Tzu-Chiang Wang, Chung-Chih Tsai
  • Publication number: 20200327867
    Abstract: The present disclosure discloses a head mounted display system including a tracking unit, a display unit and a processing unit coupled to the tracking unit and the display unit. The tracking unit is for tracking at least one of a position, an orientation and a pose of the head mounted display system and further generating a tracking result. The display unit is for displaying a virtual scene and a map of the real environment based on the tracking result in a picture-in-picture mode. The present disclosure allows a user to see the virtual scene and the map of the real environment in the picture-in-picture mode synchronously and help the user to understand a current position or a current state of the user in the real environment, which effectively ensures the user's safety and prevents injuries caused by collision when the user experiences the virtual environment.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 15, 2020
    Inventors: Tzu-Chiang Wang, Chia-Chun Lee, Si-Ying Li, Wei-Shuo Chen
  • Patent number: 9299679
    Abstract: The present invention discloses a high reliability semiconductor package structure, which includes a lower heat sink, a die, an upper heat sink, a lead frame and a package body. The lead frame and the upper heat sink contain separately a first bending unit and a second bending unit that are electrically connected. The upper and lower heat sinks are attached to two opposite surfaces of the die and sink the high power transient heat generated at the die. The lower heat sink also has an indentation that circles the die and contains extra solder that might otherwise contaminate the die. Package body contains and protects the die, the upper and lower heat sinks and the lead frame. With the implementation of the invention, the reliability of the semiconductor package structure is promoted and the EMC durability together with the operable power is enhanced.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: March 29, 2016
    Assignee: Anova Technologies Co., Ltd.
    Inventors: Wei-Li Yang, Tsung-Chieh Chou, Tzu-Chiang Wang, I, Tsang-Sheng Chang
  • Publication number: 20150243587
    Abstract: The present invention discloses a high reliability semiconductor package structure, which includes a lower heat sink, a die, an upper heat sink, a lead frame and a package body. The lead frame and the upper heat sink contain separately a first bending unit and a second bending unit that are electrically connected. The upper and lower heat sinks are attached to two opposite surfaces of the die and sink the high power transient heat generated at the die. The lower heat sink also has an indentation that circles the die and contains extra solder that might otherwise contaminate the die. Package body contains and protects the die, the upper and lower heat sinks and the lead frame. With the implementation of the invention, the reliability of the semiconductor package structure is promoted and the EMC durability together with the operable power is enhanced.
    Type: Application
    Filed: June 11, 2014
    Publication date: August 27, 2015
    Inventors: Wei-Li YANG, Tsung-Chieh CHOU, Tzu-Chiang WANG, I, Tsang-Sheng CHANG
  • Publication number: 20050198245
    Abstract: Disclosed is a remote network management system for coupling a series of remote devices, such as servers, network appliances, serial IT equipment, switches, routers, firewalls, security interfaces, application servers, load balancers, environmental controls, etc., to one or more user workstations allowing for selective access and control of the remote devices. The remote devices are all connected to a remote management unit which interfaces each user workstation to the remote devices. The power supply of each remote device is similarly connected to the remote management unit through a controllable power supply. An option menu containing a list of all of the remote devices allows a user to select and operate any of the remote devices from the remote workstation. An option menu displayable on the workstation monitor is also utilized for the user to selectively control the power to the remote devices, servers, and computers.
    Type: Application
    Filed: March 6, 2004
    Publication date: September 8, 2005
    Inventors: John Burgess, Tzu-Chiang Wang
  • Patent number: 5421822
    Abstract: The rehabilitating apparatus includes an elongated rigid main support plate conforming to a leg and having a first engaging unit at a bottom end thereof, a rigid foot support plate having a second engaging unit at a rear end and a plurality of fastening straps. The first engaging unit of the main support plate engages detachably the second engaging unit of the foot support plate to define an L-shaped member.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: June 6, 1995
    Inventor: Tzu-Chiang Wang
  • Patent number: 5282483
    Abstract: An immobilizing apparatus for an injured body part includes a rigid plate conforming to the injured body part and having two opposite faces, upon one of which the injured body part is provided; a limiting unit to limit the lateral movement of the injured body part on the rigid plate; an adjustable member by which the overall length of the rigid plate can be adjusted; and a fastening member to fasten the injured body part, immobilizing the injured body part on the rigid plate.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: February 1, 1994
    Inventor: Tzu-Chiang Wang