Patents by Inventor Tzu Chieh CHIEN

Tzu Chieh CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EUV Lithography System With 3D Sensing and Tunning Modules
    Publication number: 20240103378
    Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Wafer cassette and placement method thereof
    Patent number: 10147626
    Abstract: A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 4, 2018
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Si Jun Nian, Tzu Chieh Chien, Xiao Jin Li, Pan Lin Dong
  • WAFER CASSETTE AND PLACEMENT METHOD THEREOF
    Publication number: 20170301570
    Abstract: A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.
    Type: Application
    Filed: April 3, 2017
    Publication date: October 19, 2017
    Inventors: Si Jun NIAN, Tzu Chieh CHIEN, Xiao Jin LI, Pan Lin DONG