Patents by Inventor TZU-CHIEN YEH
TZU-CHIEN YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10897816Abstract: A rigid-flex circuit board includes a core substrate, a first adhesive layer, and a first outer conductive circuit layer. The core substrate includes a first and a second base layer, a first and a second conductive circuit layer respectively on the first and second base layer, and an insulating layer between the first and second base layer. The first and second conductive circuit layer are embedded in the insulating layer. The first adhesive layer is on the first base layer and defines a first opening which exposes the first opening. The first outer conductive circuit layer is on the first adhesive layer and defines an opening aligned with the first opening. A portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.Type: GrantFiled: June 25, 2019Date of Patent: January 19, 2021Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Tzu-Chien Yeh, Lin-Jie Gao
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Publication number: 20200077513Abstract: A rigid-flex circuit board includes a core substrate, a first adhesive layer, and a first outer conductive circuit layer. The core substrate includes a first and a second base layer, a first and a second conductive circuit layer respectively on the first and second base layer, and an insulating layer between the first and second base layer. The first and second conductive circuit layer are embedded in the insulating layer. The first adhesive layer is on the first base layer and defines a first opening which exposes the first opening. The first outer conductive circuit layer is on the first adhesive layer and defines an opening aligned with the first opening. A portion of the core substrate located within the first opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening are defined as a hard board section.Type: ApplicationFiled: June 25, 2019Publication date: March 5, 2020Inventors: TZU-CHIEN YEH, LIN-JIE GAO
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Publication number: 20190350091Abstract: A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Inventor: TZU-CHIEN YEH
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Patent number: 10412827Abstract: A rigid-flex circuit board includes a core substrate, a first outer conductive circuit layer, and a second outer conductive circuit layer. The core substrate includes a first base layer and a second base layer. A first conductive circuit layer is formed on a surface of the first base layer, and a second conductive circuit layer is formed on a surface of the second base layer. An insulating layer is located between the first base layer and the second base layer. The first conductive circuit layer and the second conductive circuit layer are embedded within the insulating layer. A portion of the core substrate located within the first opening and the second opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening and the second opening are defined as a hard board section.Type: GrantFiled: September 29, 2018Date of Patent: September 10, 2019Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Tzu-Chien Yeh, Lin-Jie Gao
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Patent number: 10412841Abstract: A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.Type: GrantFiled: December 6, 2017Date of Patent: September 10, 2019Assignees: Avary Holding (Shenzhen) CO., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventor: Tzu-Chien Yeh
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Publication number: 20190116677Abstract: A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.Type: ApplicationFiled: December 6, 2017Publication date: April 18, 2019Inventor: TZU-CHIEN YEH
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Patent number: 9872393Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.Type: GrantFiled: October 19, 2015Date of Patent: January 16, 2018Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.Inventor: Tzu-Chien Yeh
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Publication number: 20160366766Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.Type: ApplicationFiled: October 19, 2015Publication date: December 15, 2016Inventor: TZU-CHIEN YEH