Abstract: A docking station includes a casing, a floating seat, a circuit board and an electrical connector. The casing has an accommodation space, and a first through hole and a second through hole connected to the accommodation space. The floating seat includes a metal substrate, a support plate and a fastener. The metal substrate is located in the accommodation space, the support plate is located outside the accommodation space, the fastener is disposed through the support plate and the first through hole and is screwed into the metal substrate, and a size of the first through hole is greater than a size of the fastener. The circuit board is fixed to the metal substrate. The electrical connector is disposed on the circuit board and disposed through the second through hole and the support plate. A size of the second through hole is greater than a size of the electrical connector.

Abstract: A docking station includes a casing, a floating seat, a circuit board and an electrical connector. The casing has an accommodation space, and a first through hole and a second through hole connected to the accommodation space. The floating seat includes a metal substrate, a support plate and a fastener. The metal substrate is located in the accommodation space, the support plate is located outside the accommodation space, the fastener is disposed through the support plate and the first through hole and is screwed into the metal substrate, and a size of the first through hole is greater than a size of the fastener. The circuit board is fixed to the metal substrate. The electrical connector is disposed on the circuit board and disposed through the second through hole and the support plate. A size of the second through hole is greater than a size of the electrical connector.

Abstract: The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

Abstract: An electronic device and a framework assembly for the same are provided. The electronic device includes a base structure, an antenna module and a first decorative board. The base structure has a first surface and a second surface corresponding in position to the first surface. The base structure includes a base body, a receiving slot disposed on the base body, and a first positioning portion disposed on the receiving slot. The antenna module is disposed in the receiving slot of the base structure and includes a mount element and an antenna disposed on the mount element. The mount element includes a second positioning portion corresponding in position to the first positioning portion. The first decorative board is disposed on the first surface of the base structure.

Abstract: The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: A charging stand includes a casing and a quick release assembly. The casing includes a first sidewall, a second sidewall, and a bottom plate. The first and second sidewalls are disposed oppositely and connected to two edges of the bottom plate, respectively, to form a receiving chamber. The quick release assembly includes a body and a fixing element. When the quick release assembly is demountably disposed in the receiving chamber, the fixing element is engagedly disposed on the bottom plate.

Abstract: A display unit assembly of a laptop is provided and includes a metal base and a panel. The metal base has a first surface and a second surface corresponding in position to the first surface. The metal base includes a base body and a receiving recess disposed on the base body. The panel is disposed in the receiving recess and on the second surface. The panel includes a panel body and a signal transmission line connected to the panel body.

Abstract: Provided is an electronic device including a base structure, panel, water blocking film and first glue structure. The base structure has a first surface and a second surface. The base structure includes a base body, receiving recess and slit. The panel is disposed in the receiving recess and on the second surface. The panel includes a panel body and a first signal transmission element connected to the panel body. The first signal transmission element passes through the slit. The water blocking film is disposed on the first surface of the base structure to cover the slit. A first hole is disposed between the base structure and first signal transmission element or between the water blocking film and first signal transmission element. The first glue structure is disposed in the first hole. A first water blocking region is formed between the base structure, water blocking film and first glue structure.

Abstract: An electronic device and a framework assembly for the same are provided. The electronic device includes a base structure, an antenna module and a first decorative board. The base structure has a first surface and a second surface corresponding in position to the first surface. The base structure includes a base body, a receiving slot disposed on the base body, and a first positioning portion disposed on the receiving slot. The antenna module is disposed in the receiving slot of the base structure and includes a mount element and an antenna disposed on the mount element. The mount element includes a second positioning portion corresponding in position to the first positioning portion. The first decorative board is disposed on the first surface of the base structure.

Abstract: A display unit assembly of a laptop is provided and includes a metal base and a panel. The metal base has a first surface and a second surface corresponding in position to the first surface. The metal base includes a base body and a receiving recess disposed on the base body. The panel is disposed in the receiving recess and on the second surface. The panel includes a panel body and a signal transmission line connected to the panel body.

Abstract: Provided is an electronic device including a base structure, panel, water blocking film and first glue structure. The base structure has a first surface and a second surface. The base structure includes a base body, receiving recess and slit. The panel is disposed in the receiving recess and on the second surface. The panel includes a panel body and a first signal transmission element connected to the panel body. The first signal transmission element passes through the slit. The water blocking film is disposed on the first surface of the base structure to cover the slit. A first hole is disposed between the base structure and first signal transmission element or between the water blocking film and first signal transmission element. The first glue structure is disposed in the first hole. A first water blocking region is formed between the base structure, water blocking film and first glue structure.

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: A shelter module includes a casing and a sliding door. The casing has an outer surface and a limiting slot. The limiting slot sinks inward from the outer surface. The limiting slot has a bottom side, a through hole and a first tactile bump. The through hole is disposed on the bottom side. The first tactile bump protrudes from the bottom side. The sliding door slides between an open position and a closed position in the limiting slot to expose or hide the through hole. The sliding door has a hiding side facing the bottom side. The sliding door has its thickness reduced from the hiding side to form a relief recess and an interfering portion adjacent to the relief recess. As soon as the sliding door slides from the open position to the closed position, the interfering portion slides past the first tactile bump to generate a tactile feedback.

Abstract: A charging stand includes a casing and a quick release assembly. The casing includes a first sidewall, a second sidewall, and a bottom plate. The first and second sidewalls are disposed oppositely and connected to two edges of the bottom plate, respectively, to form a receiving chamber. The quick release assembly includes a body and a fixing element. When the quick release assembly is demountably disposed in the receiving chamber, the fixing element is engagedly disposed on the bottom plate.