Patents by Inventor Tzu Han Wu

Tzu Han Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12255091
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsai-Hao Hung, Ping-Cheng Ko, Tzu-Yang Lin, Fang-Yu Liu, Cheng-Han Wu
  • Patent number: 12224108
    Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.
    Type: Grant
    Filed: October 5, 2023
    Date of Patent: February 11, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Feng-Lung Chien, Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun Lee, Hsiang-Hui Hsu, Shu-Yi Tsui, Kuo-Jui Lee, Kun-Ying Lee, Mao-Chun Chen, Tai-Hsien Yu, Wei-Yu Chen, Yi-Ju Li, Kuei-Yuan Chang, Wei-Chun Li, Ni-Ni Lai, Sheng-Hao Luo, Heng-Sheng Peng, Yueh-Hui Kuan, Hsiu-Chen Lin, Yan-Bing Zhou, Chris T. Burket
  • Patent number: 10039182
    Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: July 31, 2018
    Assignees: SHENZHEN TRONIXIN ELECTRONICS CO., LTD, COMPONENT USER INDUSTRY CO., LTD
    Inventors: Yongxiang Yu, Zhijun He, Tzu Han Wu
  • Publication number: 20170318662
    Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.
    Type: Application
    Filed: December 16, 2016
    Publication date: November 2, 2017
    Applicants: Shenzhen Tronixin Electronics Co., Ltd, Component User Industry Co., LTD
    Inventors: Yongxiang YU, Zhijun HE, Tzu Han WU
  • Publication number: 20170018330
    Abstract: A SATA cable capable of grounding noise, includes a cable body; a lead group embedded in the cable body, having two ends exposed from two ends of the cable body, respectively, and comprising a signal transmitting lead group, a signal receiving lead group, power leads and ground leads, the signal transmitting lead group further comprising a first signal transmitting lead and a second signal transmitting lead, and the signal receiving lead group further comprising a first signal receiving lead and a second signal receiving lead; a first metal shield layer unit disposed on a surface of the cable body; a second metal shield layer unit disposed on another surface of the cable body; and a noise lead embedded in the cable body, electrically connected to ground leads, and having two ends exposed from the cable body to thereby electrically connect with the first metal shield layer unit.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: KUO CHEN HSU, CHI SEN CHANG, TZU HAN WU
  • Patent number: 9530540
    Abstract: A SATA cable capable of grounding noise, includes a cable body; a lead group embedded in the cable body, having two ends exposed from two ends of the cable body, respectively, and comprising a signal transmitting lead group, a signal receiving lead group, power leads and ground leads, the signal transmitting lead group further comprising a first signal transmitting lead and a second signal transmitting lead, and the signal receiving lead group further comprising a first signal receiving lead and a second signal receiving lead; a first metal shield layer unit disposed on a surface of the cable body; a second metal shield layer unit disposed on another surface of the cable body; and a noise lead embedded in the cable body, electrically connected to ground leads, and having two ends exposed from the cable body to thereby electrically connect with the first metal shield layer unit.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: December 27, 2016
    Assignee: COMPONENT USER INDUSTRY CO., LTD.
    Inventors: Kuo Chen Hsu, Chi Sen Chang, Tzu Han Wu
  • Patent number: 9356403
    Abstract: A SATA hard disk drive connector includes a body connected to a SATA hard disk drive; a signal pin unit disposed at the body and having signal transmitting/receiving pins and first grounding pins; a power pin unit disposed at the body and having power pins and second grounding pins; four micro coaxial cables each having a conducting wire, insulating layer, shielding layer and insulating coating, with the conducting wires connected to the signal transmitting/receiving pins at one end and to an external cable at another end; a first grounding unit disposed at the body and connected to an end of each shielding layer and the first grounding pins; a second grounding unit disposed at the body and connected to the second grounding pins, another end of each shielding layer, and external cable; and an electrical connection unit disposed at the body and connected to power pins and external cable.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: May 31, 2016
    Assignee: COMPONET USER INDUSTRY CO., LTD.
    Inventors: Kuo Chen Hsu, Chi Sen Chang, Tzu Han Wu