Abstract: An interconnect structure includes a first conductive feature, a first dielectric layer a first etch stop layer, a second etch stop layer, a second dielectric layer, and a second conductive feature. The first etch stop layer is disposed over the first conductive feature and the first dielectric layer. The second etch stop layer is disposed on the first etch stop layer. The second dielectric layer is disposed on the second etch stop layer. The second conductive feature includes a first conductive layer and a first barrier layer. The first conductive layer extends through the second dielectric layer, the second and the first etch stop layers to contact to the first conductive feature. The first barrier layer is sandwiched between the first conductive layer and the second dielectric layer, the first conductive layer and the second etch stop layer, and between the first conductive layer and the first etch stop layer.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.

Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.

Abstract: A SATA cable capable of grounding noise, includes a cable body; a lead group embedded in the cable body, having two ends exposed from two ends of the cable body, respectively, and comprising a signal transmitting lead group, a signal receiving lead group, power leads and ground leads, the signal transmitting lead group further comprising a first signal transmitting lead and a second signal transmitting lead, and the signal receiving lead group further comprising a first signal receiving lead and a second signal receiving lead; a first metal shield layer unit disposed on a surface of the cable body; a second metal shield layer unit disposed on another surface of the cable body; and a noise lead embedded in the cable body, electrically connected to ground leads, and having two ends exposed from the cable body to thereby electrically connect with the first metal shield layer unit.

Abstract: A SATA cable capable of grounding noise, includes a cable body; a lead group embedded in the cable body, having two ends exposed from two ends of the cable body, respectively, and comprising a signal transmitting lead group, a signal receiving lead group, power leads and ground leads, the signal transmitting lead group further comprising a first signal transmitting lead and a second signal transmitting lead, and the signal receiving lead group further comprising a first signal receiving lead and a second signal receiving lead; a first metal shield layer unit disposed on a surface of the cable body; a second metal shield layer unit disposed on another surface of the cable body; and a noise lead embedded in the cable body, electrically connected to ground leads, and having two ends exposed from the cable body to thereby electrically connect with the first metal shield layer unit.

Abstract: A SATA hard disk drive connector includes a body connected to a SATA hard disk drive; a signal pin unit disposed at the body and having signal transmitting/receiving pins and first grounding pins; a power pin unit disposed at the body and having power pins and second grounding pins; four micro coaxial cables each having a conducting wire, insulating layer, shielding layer and insulating coating, with the conducting wires connected to the signal transmitting/receiving pins at one end and to an external cable at another end; a first grounding unit disposed at the body and connected to an end of each shielding layer and the first grounding pins; a second grounding unit disposed at the body and connected to the second grounding pins, another end of each shielding layer, and external cable; and an electrical connection unit disposed at the body and connected to power pins and external cable.