Abstract: A method of forming low-k material is provided. The method includes providing a plurality of core-shell particles. The core of the core-shell particles has a first ceramic with a low melting point. The shell of the core-shell particles has a second ceramic with a low melting point and a low dielectric constant. The core-shell particles are sintered and molded to form a low-k material. The shell of the core-shell particles is connected to form a network structure of a microcrystal phase.

Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.

Abstract: An indicator module is provided, including a device housing, a circuit board, a plurality of light sources, a dividing structure, and a homogenizing plate. The device housing includes a transparent window. The circuit board is disposed in the device housing. The light sources are disposed on the circuit board, wherein each light source is adapted to provide a light beam. The dividing structure is disposed in the device housing, wherein the dividing structure defines a plurality of divided spaces, and the divided spaces respectively correspond to the light sources. The homogenizing plate is disposed in the device housing. The homogenizing plate corresponds to the divided spaces, wherein an air gap is formed between the transparent window and the homogenizing plate. The light beam enters the divided space from the light source, passes through the homogenizing plate and the air gap, and is emitted through the transparent window.

Abstract: An indicator module is provided, including a device housing, a circuit board, a plurality of light sources, a dividing structure, and a homogenizing plate. The device housing includes a transparent window. The circuit board is disposed in the device housing. The light sources are disposed on the circuit board, wherein each light source is adapted to provide a light beam. The dividing structure is disposed in the device housing, wherein the dividing structure defines a plurality of divided spaces, and the divided spaces respectively correspond to the light sources. The homogenizing plate is disposed in the device housing. The homogenizing plate corresponds to the divided spaces, wherein an air gap is formed between the transparent window and the homogenizing plate. The light beam enters the divided space from the light source, passes through the homogenizing plate and the air gap, and is emitted through the transparent window.

Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.

Abstract: An integrated circuit for on-chip speed grading comprises test circuitry comprising scan chains and a test controller; and wide-range clock signal generation circuitry comprising phase-locked loop circuitry and frequency divider circuitry. The wide-range clock signal generation circuitry is configured to generate a wide-range test clock signal for the test circuitry to conduct a structural delay test for on-chip speed grading. The wide-range test clock signal is generated based on a test clock signal associated with the test circuitry, a frequency range selection signal and a frequency setting signal.

Abstract: An integrated circuit for on-chip speed grading comprises test circuitry comprising scan chains and a test controller; and wide-range clock signal generation circuitry comprising phase-locked loop circuitry and frequency divider circuitry. The wide-range clock signal generation circuitry is configured to generate a wide-range test clock signal for the test circuitry to conduct a structural delay test for on-chip speed grading. The wide-range test clock signal is generated based on a test clock signal associated with the test circuitry, a frequency range selection signal and a frequency setting signal.