Abstract: A radiofrequency antenna device includes a carrier, an antenna structure, a high-frequency blocking unit, and a proximity sensor (P-sensor), which are disposed on the carrier. The antenna structure includes a supporting frame disposed on the carrier, a first coupling segment disposed on the supporting frame, a second coupling segment disposed on the carrier, an insulating adhesive layer connected between the first and the second coupling segments, a radiating body disposed on the supporting frame and connected to the first coupling segment, and a feeding conductor disposed on the supporting frame. The feeding conductor is configured to transmit a signal to the radiating body. The high-frequency blocking unit is electrically connected to the first coupling segment. The P-sensor is electrically connected to the high-frequency blocking unit, and the P-sensor is electrically connected to the first coupling segment and the radiating body through the high-frequency blocking unit.

Abstract: A radiofrequency antenna device includes a carrier, an antenna structure, a high-frequency blocking unit, and a proximity sensor (P-sensor), which are disposed on the carrier. The antenna structure includes a supporting frame disposed on the carrier, a first coupling segment disposed on the supporting frame, a second coupling segment disposed on the carrier, an insulating adhesive layer connected between the first and the second coupling segments, a radiating body disposed on the supporting frame and connected to the first coupling segment, and a feeding conductor disposed on the supporting frame. The feeding conductor is configured to transmit a signal to the radiating body. The high-frequency blocking unit is electrically connected to the first coupling segment. The P-sensor is electrically connected to the high-frequency blocking unit, and the P-sensor is electrically connected to the first coupling segment and the radiating body through the high-frequency blocking unit.

Abstract: A multi-core system includes a plurality of heterogeneous processor cores with different/distinct instruction set architectures, a task scheduler, and a processor manager. The processor cores are connected to a high speed bus different from a peripheral bus. The task scheduler is coupled to the processor cores and configured for dispatching at least one task to the heterogeneous processor cores. The processor manager is coupled to the processor cores and the task scheduler, and is configured for managing the heterogeneous processor cores according to information gathered from the task scheduler.

Abstract: A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

Abstract: A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.