Abstract: A motherboard includes a circuit board and a connector mounted on the circuit board. The connector comprises a socket and a latch pivotally mounted on one end of the socket. The latch comprises a body, a pressing member connected to one side of the body and extending outward from one side of the body to the outside of the socket, exposing an area from a side of the interface card for finger pressing. The supporting member is connected to another side of the body, and when the pressing member is pressed, it drives the body to pivot and causes the pushing portion to lift the interface card, and the supporting member stop the body from pivoting by resting against the circuit board.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A floated-type shielding mechanism including a cover, a shielding sheet, and a flexible conductor is provided. The cover is adapted to be fixed to a circuit board and covers a plurality of input/output (IO) ports of the circuit board. The shielding sheet is movably disposed at the cover and a back plate, and has a plurality of openings respectively corresponding to the IO ports. The flexible conductor deformably protrudes from an inner surface of the shielding sheet and is adapted to contact the IO ports. When the circuit board, the back plate, and the floated-type shielding mechanism are assembled into a case, the IO ports are exposed from a case opening and the flexible conductor is adapted to be deformed by pressing so that the shielding sheet presses against an inner wall surface around the case opening.

Abstract: A glasses assembly with a nose pad for high load includes: a pair of glasses, configured with an accommodation portion, where the glasses are smart glasses; a support, configured with a first fixing portion, at least one second fixing portion, and the first fixing portion inserted in the accommodation portion of the glasses; and a flat nose pad, two sides thereof respectively configured with a fixed portion, each of the fixed portions installed on the second fixing portion of the support. With the flat nose pad being worn on the user's nose bridge to form a fulcrum, the glasses, smart glasses can achieve leverage balance through the flat nose pad, and the flat nose pad can buffer the weight of the glasses, smart glasses, capable of significantly reducing the user's discomfort after wearing them for a long time, and preventing them from slipping downward.

Abstract: A glasses assembly with a nose pad for high load includes: a pair of glasses, configured with an accommodation portion, where the glasses are smart glasses; a support, configured with a first fixing portion, at least one second fixing portion, and the first fixing portion inserted in the accommodation portion of the glasses; and a flat nose pad, two sides thereof respectively configured with a fixed portion, each of the fixed portions installed on the second fixing portion of the support. With the flat nose pad being worn on the user's nose bridge to form a fulcrum, the glasses, smart glasses can achieve leverage balance through the flat nose pad, and the flat nose pad can buffer the weight of the glasses, smart glasses, capable of significantly reducing the user's discomfort after wearing them for a long time, and preventing them from slipping downward.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: A motherboard module is adapted for an M.2 expansion card to configure. The M.2 expansion card includes a connecting end and a fixing end. An edge of the fixing end has a semi-circular hole. The motherboard module includes a motherboard body, a locking member, and an abutting member. The motherboard body includes an expansion card slot, a first fixing hole, and a second fixing hole. The locking member is detachably fixed in the first fixing hole. The abutting member has a first end and a second end. The first end is detachably fixed in the second fixing hole. When the M.2 expansion card is installed on the motherboard module, the abutting member is located between the M.2 expansion card and the motherboard body, and the second end abuts against the M.2 expansion card. An electronic device is further provided.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: A floated-type shielding mechanism including a cover, a shielding sheet, and a flexible conductor is provided. The cover is adapted to be fixed to a circuit board and covers a plurality of input/output (IO) ports of the circuit board. The shielding sheet is movably disposed at the cover and a back plate, and has a plurality of openings respectively corresponding to the IO ports. The flexible conductor deformably protrudes from an inner surface of the shielding sheet and is adapted to contact the IO ports. When the circuit board, the back plate, and the floated-type shielding mechanism are assembled into a case, the IO ports are exposed from a case opening and the flexible conductor is adapted to be deformed by pressing so that the shielding sheet presses against an inner wall surface around the case opening.

Abstract: A motherboard module is adapted for an M.2 expansion card to configure. The M.2 expansion card includes a connecting end and a fixing end. An edge of the fixing end has a semi-circular hole. The motherboard module includes a motherboard body, a locking member, and an abutting member. The motherboard body includes an expansion card slot, a first fixing hole, and a second fixing hole. The locking member is detachably fixed in the first fixing hole. The abutting member has a first end and a second end. The first end is detachably fixed in the second fixing hole. When the M.2 expansion card is installed on the motherboard module, the abutting member is located between the M.2 expansion card and the motherboard body, and the second end abuts against the M.2 expansion card. An electronic device is further provided.

Abstract: The present invention discloses a method of forming an optical sheet. The method comprises: providing a mold having a first surface; forming a plurality of first concave shapes on the first surface of the mold such that the first surface of the mold is changed to a second surface of the mold; forming a plurality of second shapes on the plurality of first concave shapes such that the second surface of the mold is changed to a third surface of the mold; and using the third surface of the mold to emboss a film on a substrate to form a composite structure corresponding to the combination of the plurality of first concave shapes and the plurality of second shapes.

Abstract: The present invention discloses a method of forming an optical sheet. The optical sheet comprises a substrate and a film. The substrate has a first surface and a second surface opposite to the first surface. The film has a third surface and a fourth surface opposite to the third surface. The third surface of the film is on the first surface of the substrate. The fourth surface of the film comprises a structure corresponding to a combination of a plurality of first convex shapes and a plurality of second convex or concave shapes superimposed on the plurality of first convex shapes.

Abstract: An apparatus for covering a connection port assembly is disposed on a motherboard, and includes a door frame and a shielding plate. The door frame includes two support members, a connecting member, and a latch on the connecting member. A fixed end of each support members is fixed on the motherboard. Connecting ends of the two support members are connected to the connecting member to define an accommodating area for disposing the connection port assembly. The shielding plate includes an upper flange and a plate body. The plate body has one or more opening, an upper edge, and a lower edge. A signal connection surface of the connection port assembly is exposed via the opening. The upper flange is extending from the upper edge and has a latch hole. The latch is engaged into the latch hole to fix the shielding plate to the door frame.

Abstract: The present invention discloses a method of forming an optical sheet. The optical sheet comprises a substrate and a film. The substrate has a first surface and a second surface opposite to the first surface. The film has a third surface and a fourth surface opposite to the third surface. The third surface of the film is on the first surface of the substrate. The fourth surface of the film comprises a structure corresponding to a combination of a plurality of first convex shapes and a plurality of second convex or concave shapes superimposed on the plurality of first convex shapes.

Abstract: The present invention discloses a method of forming an optical sheet. The method comprises: providing a mold having a first surface; forming a plurality of first concave shapes on the first surface of the mold such that the first surface of the mold is changed to a second surface of the mold; forming a plurality of second shapes on the plurality of first concave shapes such that the second surface of the mold is changed to a third surface of the mold; and using the third surface of the mold to emboss a film on a substrate to form a composite structure corresponding to the combination of the plurality of first concave shapes and the plurality of second shapes.

Abstract: A stacked expansion card assembly is positioned on a mainboard. The mainboard includes a mainboard connector. The stacked expansion card assembly includes a first expansion card, at least one first supporting member, and a first connector. The first card includes a contact card end and electrically connected with the mainboard connector by inserting the contact end of the first expansion card to the mainboard connector. The first supporting member is positioned on the mainboard and supports the first expansion card. The first connector is positioned on the first expansion card and electrically connected or disconnected with a second expansion card by removable insertion of the second expansion card to the first connector. Thereby, the expansion cards can be installed onto the mainboard without increasing the surface area of the mainboard and limited by the layout of the electronic components on the mainboard.

Abstract: A stacked expansion card assembly is positioned on a mainboard. The mainboard includes a mainboard connector. The stacked expansion card assembly includes a first expansion card, at least one first supporting member, and a first connector. The first card includes a contact card end and electrically connected with the mainboard connector by inserting the contact end of the first expansion card to the mainboard connector. The first supporting member is positioned on the mainboard and supports the first expansion card. The first connector is positioned on the first expansion card and electrically connected or disconnected with a second expansion card by removable insertion of the second expansion card to the first connector. Thereby, the expansion cards can be installed onto the mainboard without increasing the surface area of the mainboard and limited by the layout of the electronic components on the mainboard.

Abstract: A roller type electrostatic spinning apparatus is disclosed, which includes an electrostatic spinning solution impregnation mechanism having a tank for containing an electrostatic spinning solution and a sizing roller rolled in the tank, a chain emitting electrode touching the sizing roller to coat the electrostatic spinning solution onto the chain emitting electrode, a collecting electrode, and a high-voltage power supply connected to the chain emitting electrode and the collecting electrodes respectively.

Abstract: An apparatus for manufacturing nonwoven fabric including a spinning nozzle, a fiber extension device, a receiver device and a sprinkler is provided. The spinning nozzle is filled with a spinning solution and has a plurality of spinners, where each of the spinners includes a spinning port and a main gas port surrounding the spinning port. The fiber extension device is disposed under the spinning nozzle and includes at least one secondary gas supply device. The secondary gas supply device has an arc gas distribution portion, such that the direction of gas ejected from the secondary gas supply device is the same as the direction of gas ejected from the main gas port. The receiver device is disposed under the fiber extension device. The sprinkler is disposed above the fiber extension device or the receiver device.

Abstract: A machine for manufacturing a nonwoven fabric includes a conveyer net, a spunbonding apparatus, and a container. In use, the spunbonding apparatus can project at least one fiber onto the conveyer net. The container can contain liquid, wherein the liquid level of the container is higher than at least a part of the conveyer net which the fiber is projected onto.