Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

Abstract: A computer-dedicated auxiliary data access device comprised of a device case having a minimum of one horizontal slot in the front side and, furthermore, a housing cavity perpendicularly formed inward beyond the horizontal slot, a universal serial bus interface socket installed at the end section of the housing cavity, an IC circuit board disposed in parallel alignment with the horizontal slot, a card terminal connector respectively situated at the end face of the IC circuit board, and a number of perpendicularly supportive spring contacts of the card terminal connector that are connected via a flat cable routed to the interface socket. The horizontal slot provides for the sideways insertion of an ultra thin flat memory card, with the memory card internally consisting of high-speed flash memory chips and also including a main controller IC and a memory IC which have a read/write specification of 10,000 times to enable the rapid reading and writing of data.