Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A charging system includes a source terminal and a sink terminal. The control method of the charging system includes transmitting a bus voltage by the source terminal, determining whether the sink terminal has entered a sink attached state when the sink terminal receives the bus voltage, enabling a message transceiver of the sink terminal if the sink terminal has entered the sink attached state, transmitting a source message to the transceiver of the sink terminal by the source terminal, transmitting a request message to the source terminal by the message transceiver of the sink terminal while the source terminal transmits the source message, and continuing to enable a communication function for communicating with the sink terminal and continuing to transmit the bus voltage to the sink terminal by the source terminal when the source terminal receives the request message.

Abstract: A charging system includes a source terminal and a sink terminal. The control method of the charging system includes transmitting a bus voltage by the source terminal, determining whether the sink terminal has entered a sink attached state when the sink terminal receives the bus voltage, enabling a message transceiver of the sink terminal if the sink terminal has entered the sink attached state, transmitting a source message to the transceiver of the sink terminal by the source terminal, transmitting a request message to the source terminal by the message transceiver of the sink terminal while the source terminal transmits the source message, and continuing to enable a communication function for communicating with the sink terminal and continuing to transmit the bus voltage to the sink terminal by the source terminal when the source terminal receives the request message.

Abstract: Disclosed is a water-cooling device for a solid-state disk, comprising: a water-cooling component, including a water block and a water pump disposed in the water block, the water block being provided with a heat conducting member to form heat conduction with the solid-state disk; a first pipe; a second pipe; and a water-cooling radiator component having a heat radiator, wherein the first pipe and the second pipe are connected between the radiator and the water-cooling component, the water pump is provided to drive cooling liquid to flow in a liquid circulating sequence of the water-cooling component, the second pipe, the water-cooling radiator component, the first pipe and the water-cooling component, and the heat radiator of the water-cooling radiator component is provided to transfer heat from the cooling liquid to the air.

Abstract: Disclosed is an active cooling storage device comprising: a memory having memory chips; a thermal pad attached to the memory chips; a heat dissipater having a heat sink and a metal base, a receiving concave being provided between the heat sink and the metal base, the metal base being contacted with a bottom surface of the heat sink an upper surface of the thermal pad; a thermoelectric cooler, which is disposed within the receiving concave in such a manner that a cold side of the thermoelectric cooler facing an upper surface of at least one of the memory chips and facing toward the metal base, and a hot side of the thermoelectric cooler facing toward the heat sink; and a cooler controller, which receives a memory temperature value of the memory, and controlling the thermoelectric cooler to be activated when the memory temperature value is higher than a threshold temperature value.

Abstract: A luminous solid-state disk, comprises: a solid-state disk; a light-emitting member; a light-emitting controller; a disk enclosure accommodating the solid-state disk, the light-emitting member and the light-emitting controller, the disk enclosure having a connection interface, the light-emitting controller in connection to the connection interface to receive, through the connection interface, a computer terminal information from a computer, the light-emitting controller uses, according to the computer terminal information, a control signal to control the light-emitting member, the disk enclosure having a main wall surface, which is transparent, wherein light from the light-emitting member directly transmits through the main wall surface or is reflected to transmit through the main wall surface. Through the above structure, the main wall surface can be used as an information display to inform the user of the computer information.

Abstract: An autostereoscopic display device having touch sensing mechanism includes a display panel for illustrating images, a touch sensing panel for detecting touch events, a 2D/3D switching panel disposed between the display panel and the touch sensing panel, and a control unit. The 2D/3D switching panel has a substrate, a first electrode disposed on the substrate, a counter substrate, and a second electrode disposed on the counter substrate. The control unit is employed to provide a first control signal and a second control signal furnished to the first electrode and the second electrode respectively. The first control signal is switched between a first high voltage and a first low voltage in a gradual-shift manner. The second control signal is switched between a second high voltage and a second low voltage in a gradual-shift or rapid-shift manner.

Abstract: An autostereoscopic display device having touch sensing mechanism includes a display panel for illustrating images, a touch sensing panel for detecting touch events, a 2D/3D switching panel disposed between the display panel and the touch sensing panel, and a control unit. The 2D/3D switching panel has a substrate, a first electrode disposed on the substrate, a counter substrate, and a second electrode disposed on the counter substrate. The control unit is employed to provide a first control signal and a second control signal furnished to the first electrode and the second electrode respectively. The first control signal is switched between a first high voltage and a first low voltage in a gradual-shift manner. The second control signal is switched between a second high voltage and a second low voltage in a gradual-shift or rapid-shift manner.

Abstract: A method for detecting touch signals of a touch screen device includes counting a first time slot and a second time slot of an on-off period of a pixel according to a period of a scan signal and a period of a clock signal, and detecting whether the pixel is touched during the second time slot. The first time slot is the time before a noise of the pixel drops to a predetermined value after the pixel is turned on. The second time slot is the time after the noise of the pixel drops to the predetermined value after the pixel is turned on.