Patents by Inventor Tzu-Hsin Chen

Tzu-Hsin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984444
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a first active region extending along a first direction. The semiconductor device also includes a second active region extending along the first direction. The semiconductor device further includes a first gate extending along a second direction perpendicular to the first direction. The first gate has a first segment disposed between the first active region and the second active region. In addition, the semiconductor device includes a first electrical conductor extending along the second direction and across the first active region and the second active region, wherein the first segment of the first gate and the first electrical conductor are partially overlapped to form a first capacitor.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chung-Hui Chen, Wan-Te Chen, Tzu Ching Chang, Tsung-Hsin Yu
  • Publication number: 20240103378
    Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Patent number: 10978269
    Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: April 13, 2021
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Po Tsung Hsieh, Chung Jen Chung, Shih Wen Tseng, Chiu Hua Huang, Tzu Hsin Chen, Ya Wen Tsai
  • Publication number: 20190272972
    Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.
    Type: Application
    Filed: November 27, 2018
    Publication date: September 5, 2019
    Inventors: Po Tsung Hsieh, Chung Jen Chung, Shih Wen Tseng, Chiu Hua Huang, Tzu Hsin Chen, Ya Wen Tsai
  • Publication number: 20160263050
    Abstract: The present invention provides a method for inducing death of a cancer cell in a subject in need thereof comprising administering to the subject a pharmaceutically effective amount of Nelumbo Nucifera leave water extract, wherein the Nelumbo Nucifera leave water extract comprises polyphenols.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 15, 2016
    Applicant: Chung Shan Medical University
    Inventors: Chau-Jong Wang, Mon-Yuan Yang, Tzu-Hsin Chen