Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract: A radiator fan module has a fan assembly, cooling fin and heat conductor. The fan assembly has a shell seat and fan blade, an air outlet is set at one side of the shell seat, the cooling fin is set correspondingly to the outlet, and the cooling end of the conductor is mated with the fin. The outlet forms an inward extended wall, an outward extended wall and an extended inner space set between the outlet and fan blade. The outlet has a width-reducing pattern. A notched space is formed externally between the inward extended wall and shell seat. An inward extended heat conductor is formed by the extension of the inner end of the cooling fin and is located within the range of the extended inner space, and provided with a blade corresponding side that is located correspondingly to a peripheral position of the blade.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract: A photovoltaic module includes a solar module and a heat sink bonded with a solar unit in a vacuum heating pressing manner. The heat sink is used for dissipating thermal energy generated by the solar module. Through the structure, heat of the solar module can be dissipated more effectively, thereby increasing efficiency of photoelectric conversion. Besides, the structure of the photovoltaic module is simplified, a heat conduction interface material in the prior art is not required, and assembly can be performed in the vacuum heating pressing manner, thereby greatly simplifying the manufacturing procedure.

Abstract: The present invention provides a heat pipe structure of a heat radiator, which includes two vertically protruded radiating portions and heat-absorbing portions at a bottom of the two radiating portions. The heat-absorbing portions are assembled onto the heat-conducting pedestal. Two turning portions are formed at the intersection of the heat-absorbing portions and two radiating portions. The heat-absorbing portion has a curved shape. The heat-absorbing portions of adjacent heat pipes are misaligned, such that the turning portion of the heat-absorbing portion of one heat pipe aligns with the recessed space of the other heat pipe. A minimum of heat pipe assembly space obtains a maximum heating area, thus greatly improving the heat-radiating effect and reducing the manufacturing cost with better applicability and economic efficiency.

Abstract: An integrated circuit having a thin passivation layer that facilitates laser programming, and applications thereof. In an embodiment, the integrated circuit includes a metal layer that has at least one fuse. A passivation layer is deposited over the metal layer. The passivation layer has a thickness that is less than 4,500 angstroms in order to enable laser programming of the at least one fuse without having to etch the passivation layer in the area of the at least one fuse prior to laser programming. In embodiments, the passivation layer has a thickness that is in a range of about 2,000 angstroms to about 4,000 angstroms, and the metal layer includes copper metal conductors that are protected by a barrier metal such as, for example, titanium nitride (TiN) or silicon nitride (SiN).

Abstract: The present invention is a metal bond pad that provides electrical and mechanical connection to an integrated circuit (IC). The metal bond pad is configured to accommodate for probe travel during probing measurements, without modifying the size of the passivation opening of the bond pad. This enables higher density of active devices on the IC and therefore increases integration and lowers IC cost. The metal bond pad for the integrated circuit includes a substrate, a first metal layer, and a second metal layer. The substrate has the first metal layer disposed therein, having an opening from the top surface of the substrate. The second metal layer has a first-end portion, a second-end portion and a center portion disposed between the first-end portion and the second-end portion. The center portion of the second metal layer is aligned with the opening in the substrate and a bottom surface of the center portion is in contact with the top surface of the first metal layer.

Abstract: The present invention is a metal bond pad that provides electrical and mechanical connection to an integrated circuit (IC). The metal bond pad is configured to accommodate for probe travel during probing measurements, without modifying the size of the passivation opening of the bond pad. This enables higher density of active devices on the IC and therefore increases integration and lowers IC cost. The metal bond pad for the integrated circuit includes a substrate, a first metal layer, and a second metal layer. The substrate has the first metal layer disposed therein, having an opening from the top surface of the substrate. The second metal layer has a first-end portion, a second-end portion and a center portion disposed between the first-end portion and the second-end portion. The center portion of the second metal layer is aligned with the opening in the substrate and a bottom surface of the center portion is in contact with the top surface of the first metal layer.

Abstract: A semiconductor wafer configured for in-process testing of integrated circuitry fabricated thereon. At least two die are separated by a scribe area, and each of the die has at least one complementary metal oxide silicon (CMOS) static random access memory (SRAM) array embedded therein among mixed-signal CMOS circuitry. The mixed-signal CMOS circuitry includes devices with larger feature sizes compared to similar devices of the embedded SRAM array. A first process control monitor (PCM) testline is included, which has a first layout corresponding to the mixed-signal CMOS circuitry. Additionally, a second PCM testline is included, which has a second layout corresponding to the embedded SRAM arrays. The first and second PCM testlines are formed in the scribe area.

Abstract: An upper lid alignment apparatus for hatchback reaction cabin includes at least three sets of mating members. Each mating member has a protruding active member located on a side wall of an upper lid and a receiving member located on a side wall of a table. The receiving member has a guide slope to guide the active member to slide and reset on an anchor spot on the receiving member. The upper lid hence may make closed contact with the table to form a sealed cabin for reaction process.

Abstract: A clamp used in clamping semi-conductor wafers during processing operations permits ready release of the wafer and avoids adherence of the clamp to materials deposited onto the wafer which otherwise tend to stick the wafer to the clamp. Adhesion of the deposited materials to the clamp is avoided by providing the clamping surfaces of the clamp with a minimum surface roughness achieved by machining, grinding, etching or other techniques.

Abstract: An arc chamber including a reaction chamber, a filament element used to generate electrons, a first power supply means set for providing power to the filament element, a second power supply means utilized for creating a potential to increase the ionization efficiency, a plurality of gas injected openings set to inject suitable gas into the reaction chamber and be ionized in a gaseous plasma by impact from electrons, a first filament insulator, and three second filament insulators used for isolation. The first filament insulator includes a truncated corn portion and a ring portion. The truncated corn portion has a hole formed threrethrough itself. The ring portion is coaxially connected to the smaller surface of the truncated corn portion. The second filament insulator includes a truncated corn portion and two ring portions. Similarily, the truncated corn portion has a hole through formed therethrough. The ring portions are respectively coaxially connected to the two surfaces of the truncated corn portion.