Abstract: A memory card supporting near field communication through single wire protocol includes a power management unit, an interface control unit, a data storage unit, a power protection unit and an intelligent unit. The power protection unit is interposed between the power management unit and a near field voltage source of the near field communication unit to prevent short-circuit induced by direct connection there between. Moreover, direct connection between the power management unit and the intelligent unit can also be prevented, which can protect against bursts of excessive voltages or currents that may damage the data in the intelligent unit. Additionally, the power protection unit can prevent power leakage from the power management unit and the near field voltage source, which solves the problem of improperly driving near field communication or insufficient power supply to the interface control unit or intelligent unit.

Abstract: A memory card supporting near field communication through single wire protocol includes a power management unit, an interface control unit, a data storage unit, a power protection unit and an intelligent unit. The power protection unit is interposed between the power management unit and a near field voltage source of the near field communication unit to prevent short-circuit induced by direct connection there between. Moreover, direct connection between the power management unit and the intelligent unit can also be prevented, which can protect against bursts of excessive voltages or currents that may damage the data in the intelligent unit. Additionally, the power protection unit can prevent power leakage from the power management unit and the near field voltage source, which solves the problem of improperly driving near field communication or insufficient power supply to the interface control unit or intelligent unit.

Abstract: A data tracking method applied in semiconductor manufacturing is provided. Split historical data of a wafer lot is retrieved and it is determined whether the end of lot data of the wafer lot is read. If not, a maximum split number required for a split processing applied to the wafer lot is determined. Next, a virtual sub split number required for the current process station is determined according to the maximum split number and a current split number. At least one virtual sub lot for the current process station is created according to the virtual sub split number. Process data of an original wafer lot corresponding to the virtual sub lot is copied to the virtual sub lot and virtual sub lots for the next process station is continuously created when creation is complete.

Abstract: A data tracking method applied in semiconductor manufacturing is provided. Split historical data of a wafer lot is retrieved and it is determined whether the end of lot data of the wafer lot is read. If not, a maximum split number required for a split processing applied to the wafer lot is determined. Next, a virtual sub split number required for the current process station is determined according to the maximum split number and a current split number. At least one virtual sub lot for the current process station is created according to the virtual sub split number. Process data of an original wafer lot corresponding to the virtual sub lot is copied to the virtual sub lot and virtual sub lots for the next process station is continuously created when creation is complete.