Patents by Inventor TZU-HSIU PENG

TZU-HSIU PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120900
    Abstract: A suspended resonator including a vibration structure, a first electrode, and a second electrode is provided. The vibration structure includes a vibration region, a frame portion, and a connecting portion. The vibration region includes a plate portion and a thickening portion. The plate portion has a first surface and a second surface opposite to each other. The thickening portion surrounds a central part of the plate portion, and an edge part of the plate portion is sandwiched in the thickening portion. A thickness of the thickening portion is greater than a thickness of the plate portion. The frame portion surrounds the vibration region and maintains a gap with the vibration region. The connecting portion connects the thickening portion with the frame portion. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface.
    Type: Application
    Filed: February 2, 2023
    Publication date: April 11, 2024
    Applicant: TXC Corporation
    Inventors: Shih-Yung Pao, Tzu-Hsiu Peng, Zong-De Lin
  • Publication number: 20240048122
    Abstract: A resonator including a vibration structure, a first electrode, and a second electrode is provided. The vibration structure includes a vibration region, a protrusion portion, an opening, and a frame portion. The vibration region has a first surface and a second surface opposite to the first surface. The protrusion portion surrounds the vibration region. The opening is disposed at a side of the vibration region and between the vibration region and the protrusion portion. The opening has a first side adjacent to the vibration region and a second side far away from the vibration region. The second side is opposite to the first side. A length of the first side is greater than a length of the second side. The frame portion surrounds the protrusion portion. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface.
    Type: Application
    Filed: November 16, 2022
    Publication date: February 8, 2024
    Applicant: TXC Corporation
    Inventors: Tzu-Hsiu Peng, Wei-Chen Lo, Zong-De Lin
  • Publication number: 20220320416
    Abstract: A structure for packaging a crystal oscillator includes a package base, at least one glue, a resonant crystal blank, and a top cover. The top of the package base has a recess. The glue is formed in the recess. The resonant crystal blank has at least one opening, at least one border area, at least one connection area, and a resonant area. The opening is arranged between the border area and the resonant area. The border area is connected to the resonant area through the connection area. The border area is formed in the recess through the glue. The top cover is formed on the top of the package base. The top cover closes the recess, the at least one glue, and the resonant crystal blank.
    Type: Application
    Filed: July 13, 2021
    Publication date: October 6, 2022
    Inventor: TZU-HSIU PENG
  • Publication number: 20220321089
    Abstract: A vibration-absorbing structure for packaging a crystal resonator includes a package base, a resonant crystal blank, and a top cover. The top of the package base has a recess. The sidewall of the package base surrounds the recess. The resonant crystal blank has a border area, at least one serpentine connection area, and a resonant area. The serpentine connection area is connected between the border area and the edge of the resonant area. The border area is arranged on the sidewall. The top cover, arranged on the border area, covers the recess, the at least one serpentine connection area, and the resonant area.
    Type: Application
    Filed: July 13, 2021
    Publication date: October 6, 2022
    Inventors: TZU-HSIU PENG, WEI-CHEN LO, ZONG-DE LIN