Abstract: A vehicle power monitoring and auxiliary starting device is provided. The device includes a case, a supercapacitor module, a first circuit, and a second circuit. The at least one supercapacitor module is connected in series through the first circuit, the second circuit includes a balanced charging and controlling circuit, a display module, a relay control circuit and a boost circuit. The first circuit has a positive pole and a negative pole connected with the vehicle battery's positive pole and negative pole. The power of the vehicle battery maintains a certain amount of reserve power, and the balanced charging and controlling circuit of the second circuit monitor the vehicle battery.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a first side and a second side opposing the first side. The substrate has one or more sidewalls defining a trench extending along opposing sides of a pixel region having a first width. An isolation structure including one or more dielectric materials is disposed within the trench. The isolation structure has a second width. An image sensing element and a focal region are disposed within the pixel region. The focal region is configured to receive incident radiation along the second side of the substrate. A ratio of the second width to the first width is in a range of between approximately 0.1 and approximately 0.2, so that the focal region is completely confined between interior sidewall of the isolation structure facing the image sensing element.

Abstract: A gas detection system for gynecological disease detection and a detection method using the same are provided. The gas detection system is configured to detect an analyte from a female vagina and includes a main body, a sleeve, a detector, a pump, and a controller. The main body includes a body portion and a head portion having an intake channel. The body portion includes a detection chamber and an exhaust channel. The detector includes at least one sensor configured to detect at least one target of the analyte and produce at least one detection signal. The pump is communicated with the detection chamber and the exhaust channel. The controller includes a processing unit and a first communication unit. The processing unit receives the at least one detection signal and controls the first communication unit to send the at least one detection signal.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor device including a shallow trench isolation (STI) structure disposed between a first side and a second side of the semiconductor substrate. An intermetal dielectric structure comprising a first metal interconnect is on the second side. A first etching process is performed to form a first trench extending from the first side of the semiconductor substrate to the STI structure. An etch stop layer is deposited on the first side. A dielectric material is deposited into the first trench to form a dielectric spacer. A second trench is etched during a second etching process. The second trench is aligned with the first trench and extends through the STI structure to the first metal interconnect. A conductive material is deposited into the second trench to form a contact pad that contacts the first metal interconnect.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a first side and a second side opposing the first side. The substrate has one or more sidewalls defining a trench extending along opposing sides of a pixel region having a first width. An isolation structure including one or more dielectric materials is disposed within the trench. The isolation structure has a second width. An image sensing element and a focal region are disposed within the pixel region. The focal region is configured to receive incident radiation along the second side of the substrate. A ratio of the second width to the first width is in a range of between approximately 0.1 and approximately 0.2, so that the focal region is completely confined between interior sidewall of the isolation structure facing the image sensing element.

Abstract: IL-12 variants are provided. Also provided are antibodies that specifically bind to PD1. Also provided are fusion proteins of IL-12 variants and anti-PD1 antibodies. Also provided are uses of these IL-12 variants, anti-PD1 antibodies, fusion proteins, and related compositions and methods.

Abstract: A brain tumor types distinguish system includes an image outputting device and a server computing device. The image outputting device outputs at least three brain images captured from the position of a brain tumor. The server computing device pre-stores a plurality of distinguish pathways corresponding to different types of brain tumors. The server computing device includes an image receiving module, an image pre-processing module, a data comparison module and a distinguish module. The image receiving module receives the brain images. The image pre-processing module pre-processes the brain images to obtain corresponding processed images thereof. The data comparison module compares the brain images and the processed images with the distinguish pathways to obtain at least three comparison results. The distinguish module statistically analyzes the comparison results to obtain a distinguish result.

Abstract: A benign tumor development trend assessment system includes an image outputting device and a server computing device. The image outputting device outputs first/second images captured from the same position in a benign tumor. The server computing device includes an image receiving module, an image pre-processing module, a target extracting module, a feature extracting module and a trend analyzing module. The image receiving module receives the first/second images. The image pre-processing module pre-processes the first/second images to obtain first/second local images. The target extracting module automatically detects and delineates tumor regions from the first/second local images to obtain first/second region of interest (ROI) images. The feature extracting module automatically identifies the first/second ROI images to obtain at least one first/second features. The trend analyzing module analyzes the first/second features to obtain a tumor development trend result.

Abstract: A method for enhancing an accuracy of a benign tumor development trend assessment system includes: a first processing procedure, an image captured before the treatment is inputted to and be processed by a server computing device of the benign tumor development trend assessment system to obtain a first processing result; a second processing procedure, the images captured before and in at least one period after the treatment are inputted to and processed by the server computing device to obtain a second processing result; a trend analyzing procedure, the trend analyzing module of the server computing device analyzes the first processing result, the second processing result and the trend pathways to obtain a tumor development trend result; and a storing procedure, the first processing result, the second processing result and the tumor development trend result are transformed to an individual trend pathway which is stored in the trend analyzing module.

Abstract: A benign tumor development trend assessment system includes an image outputting device and a server computing device. The image outputting device outputs first/second images captured from the same position in a benign tumor. The server computing device includes an image receiving module, an image pre-processing module, a target extracting module, a feature extracting module and a trend analyzing module. The image receiving module receives the first/second images. The image pre-processing module pre-processes the first/second images to obtain first/second local images. The target extracting module automatically detects and delineates tumor regions from the first/second local images to obtain first/second region of interest (ROI) images. The feature extracting module automatically identifies the first/second ROI images to obtain at least one first/second features. The trend analyzing module analyzes the first/second features to obtain a tumor development trend result.

Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a plurality of first finger circuits of the first sensing circuit and a plurality of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

Abstract: A pressure sensor includes a conductive substrate, a ring-shaped spacer, an inner spacer and a sensing circuit substrate. The conductive substrate includes a conductive-substrate body and a conductive layer. The conductive layer is disposed on the conductive-substrate body. The ring-shaped spacer and the inner spacer are disposed on the conductive-substrate body. The sensing-circuit substrate, disposed on the ring-shaped spacer and the inner spacer, includes a circuit-substrate body, a first sensing circuit and a second sensing circuit. The first sensing circuit and the second sensing circuit are disposed on opposing sides of the circuit-substrate body, and a priority of first finger circuits of the first sensing circuit and a priority of second finger circuits of the second sensing circuit are interlaced. The first sensing circuit and the second sensing circuit are densely arranged at the center of the conductive layer and less densely arranged on both sides of the conductive layer.

Abstract: A stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first and the second elastic insulating layers include the same elastic resin, and the first and the second elastic conductive layer include the same elastic resin and the same conductive material. The elastic dielectric layer includes the elastic resin and a dielectric material, in which the dielectric material comprises at least one of an Sr1-xCaxTiO3 compound, an Sr1-yBayTiO3 compound, and a BaTiO3 compound so as to make the dielectric constant of the dielectric material within 15.65-2087.3 F/m.

Abstract: A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.

Abstract: A lamination type stretch sensor includes a first elastic insulating layer, a first elastic conductive layer, an elastic dielectric layer, a second elastic conductive layer and a second elastic insulating layer sequentially piled together thereon. The first elastic conductive layer includes a plurality of first coupling sections and a plurality of first connecting sections. The second elastic conductive layer includes a plurality of second coupling sections and a plurality of second connecting sections disposed between the second coupling sections. The elastic dielectric layer is deposited between the first elastic conductive layer and the second elastic conductive layer.

Abstract: A slide type variable resistor with a resistance adjusting member, comprising a housing, two side rails, a circuit module, a control member and a base. The housing includes a housing limiting hole and a space. The two side rails are disposed in the space. The circuit module is disposed in the space and has a resistive circuit. The control member is disposed in the space. The control member includes an object, at least one metal brush, a handle and an elastic member. The object having a bump, and the elastic member is sleeved at the bump.

Abstract: A variable resistor with a light emitting element includes a circuit board, a housing and a slide assembly. The circuit board extending in a longitudinal direction has a circuit arrangement surface to arrange thereon a resistive circuit and a power circuit. The housing fixed to the circuit board so as to form a slide space has a sliding slot extending in the longitudinal direction. The slide assembly further includes a slidable member, a fader set, a light emitting element, a resistive circuit brush and two light-emitting element brushes. The fader set fixed at the slidable member penetrates the sliding slot. The light emitting element in an accommodating groove of the slidable member projects a light beam toward the fader set. The resistive circuit brush electrically connects the resistive circuit. The two light-emitting element brushes electrically bridge the power circuit and the light emitting element.

Abstract: A finger movement-sensing assembly includes a flexible substrate, a bend-sensing circuit structure and a depression-sensing circuit structure. The flexible substrate extends in a first direction for use on a finger. The flexible substrate has an outer extension section and an inner deflection section. The outer extension section is applied to be mounted onto a back of the finger, and the inner deflection section is applied to be mounted onto a pulp of the finger. The bend-sensing circuit structure is disposed on the outer extension section to produce a bend-sensing signal. The depression-sensing circuit structure is disposed on the inner deflection section to produce a depression-sensing signal.

Abstract: Novel chimeric moieties that show significant efficacy against cancers are provided. In certain embodiments the chimeric moieties comprise a targeting moiety attached to an interferon. In certain embodiments, the chimeric moieties comprise fusion proteins where an antibody that specifically binds to a cancer marker is fused to interferon alpha (IFN-?) or interferon beta (IFN-?).