Abstract: A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.

Abstract: A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. Holes are formed on a surface of the substrate, wherein the holes are located within a projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material surrounds the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate are exposed by the molding material.

Abstract: The present application provides a touch sensing circuit, which comprises a plurality of analog front-end circuits, a noise processing circuit, and a compensation circuit. The analog front-end circuits generate a plurality of output signals according to a plurality of sensing signals. The noise processing circuit is coupled to the analog front-end circuits and generates an average noise according to the output signals. The compensation circuit is coupled to the noise processing circuit and compensates the output signals according to the average noise. By applying the touch sensing circuit of the present application, the influence of common-mode noise may be suppressed and the sensitivity of sensing touches may be improved.

Abstract: Techniques pertaining to dynamic band selection in multi-link operation (MLO) with time averaged specific absorption rate (TA-SAR) information in wireless communications are described. An apparatus determines a resource allocation regarding one or more multi-link operation (MLO) bands. The apparatus then allocates at least one of a transmit (TX) power, a TX duty cycle and a modulation and coding scheme (MCS) rate in wirelessly transmitting in the one or more MLO bands to result in a TA-SAR that is no greater than a predefined limit.

Abstract: The present disclosure provides a method and an apparatus of controlling a semiconductor manufacturing device, a medium and a semiconductor manufacturing device. The method of controlling a semiconductor manufacturing device includes: receiving a control instruction, and cutting off or turning on a first airflow path; and when the first airflow path is cut off based on the control instruction, driving an air pumping terminal of an air pumping pipe to be connected to an air outlet terminal of an air intake pipe, and turning on a negative pressure generating device and pumping air from the air intake pipe; or when the first airflow path is turned on based on the control instruction, driving the air pumping terminal to be disconnected from the air outlet terminal of the air intake pipe, and turning off the negative pressure generating device and stopping pumping.

Abstract: The present invention relates to a sensing circuit with signal compensation, which comprises a first sensing element, a second sensing element and a differential amplifying circuit, the differential amplifying circuit generates an output signal through a differential compensation according to a common mode voltage, a first sensing signal and a second sensing signal. Hereby, reducing the noise of the sensing circuit is achieved, and the interference of the display driving signal may be effectively improved.