Patents by Inventor Tzu-Hua LIN

Tzu-Hua LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor bonding structure
    Patent number: 9196595
    Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: November 24, 2015
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hua Chen, Tzu-Hua Lin, Kuan-Neng Chen, Yan-Pin Huang
  • Method for transferring data stream
    Patent number: 9019808
    Abstract: A method for transmitting data stream includes the steps of analyzing a request to generate a transmitting command, calculating a data receiving ability of a receiving end when receiving the transferring command, calculating an I frame dividing rate, a P frame dividing rate, and a B frame dividing rate based on the data receiving ability, dividing an I frame, a P frame, and a B frame based on the I frame dividing rate, the P frame dividing rate, and the B frame dividing rate to generate a plurality of I frame segments, P frame segments, and B frame segments, transmitting the I frame segments, P frame segments, and B frame segments of the data stream to the receiving end in turn base on the data receiving ability.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: April 28, 2015
    Assignee: Institute for Information Industry
    Inventors: Chung-Ming Huang, Yuan-Tse Yu, Tzu-Hua Lin
  • SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
    Publication number: 20140239494
    Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 28, 2014
    Inventors: Kuo-Hua CHEN, Tzu-Hua LIN, Kuan-Neng CHEN, Yan-Pin HUANG
  • METHOD FOR TRANSFERRING DATA STREAM
    Publication number: 20140146658
    Abstract: A method for transmitting data stream includes the steps of analyzing a request to generate a transmitting command, calculating a data receiving ability of a receiving end when receiving the transferring command, calculating an I frame dividing rate, a P frame dividing rate, and a B frame dividing rate based on the data receiving ability, dividing an I frame, a P frame, and a B frame based on the I frame dividing rate, the P frame dividing rate, and the B frame dividing rate to generate a plurality of I frame segments, P frame segments, and B frame segments, transmitting the I frame segments, P frame segments, and B frame segments of the data stream to the receiving end in turn base on the data receiving ability.
    Type: Application
    Filed: December 17, 2012
    Publication date: May 29, 2014
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Chung-Ming HUANG, Yuan-Tse YU, Tzu-Hua LIN