Patents by Inventor Tzu-Hua TSENG

Tzu-Hua TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996227
    Abstract: Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng
  • Patent number: 11942433
    Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang
  • Publication number: 20240066392
    Abstract: A control assembly includes two controllers and a retractable and foldable mechanism, the retractable and foldable mechanism includes two retractable parts and a central part, and the two controllers are respectively movably connected to two opposite ends of the central part via the two retractable parts.
    Type: Application
    Filed: May 5, 2023
    Publication date: February 29, 2024
    Applicant: DEXIN CORP.
    Inventors: Ho Lung LU, Chin-Lung LIN, Tzu-Hua TSENG
  • Publication number: 20240058693
    Abstract: A control assembly includes two controllers and a retractable and foldable mechanism including a retractable part and two pivot joints, the two pivot joints are respectively pivotally connected to two opposite ends of the retractable part, the two controllers are respectively pivotally connected to the two pivot joints so that the two controllers are movably connected to the retractable part via the two pivot joints, respectively.
    Type: Application
    Filed: February 21, 2023
    Publication date: February 22, 2024
    Applicant: DEXIN CORP.
    Inventors: Ho Lung LU, Chin-Lung LIN, Tzu-Hua TSENG