Patents by Inventor Tzu-Huan Peng

Tzu-Huan Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microphone having an airtight back chamber
    Patent number: 10924845
    Abstract: A microphone includes an outer casing, a carrier disposed in the outer casing, and a sound receiving module connected to the carrier. The carrier has a through hole opposite to the sound receiving module. An airtight unit includes a shock absorber and an airtight member cooperating with the outer casing and the carrier to define an airtight back chamber configured to generate a pneumatic wave when a mechanical vibration wave is transmitted to the outer casing. A damping material closes the through hole and is configured to change the phase of the pneumatic wave when the latter passes therethrough such that the pneumatic wave and the mechanical vibration wave can offset each other when they are transmitted to the sound receiving module.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: February 16, 2021
    Assignee: Taiwan Carol Electronics Co., Ltd
    Inventors: Tzu-Huan Peng, Chung-Chi Lai, Chao-Chih Chang
  • Microphone Having an Airtight Back Chamber
    Publication number: 20200366985
    Abstract: A microphone includes an outer casing, a carrier disposed in the outer casing, and a sound receiving module connected to the carrier. The carrier has a through hole opposite to the sound receiving module. An airtight unit includes a shock absorber and an airtight member cooperating with the outer casing and the carrier to define an airtight back chamber configured to generate a pneumatic wave when a mechanical vibration wave is transmitted to the outer casing. A damping material closes the through hole and is configured to change the phase of the pneumatic wave when the latter passes therethrough such that the pneumatic wave and the mechanical vibration wave can offset each other when they are transmitted to the sound receiving module.
    Type: Application
    Filed: March 20, 2020
    Publication date: November 19, 2020
    Inventors: Tzu-Huan Peng, Chung-Chi Lai, Chao-Chih Chang