Abstract: A bicycle caliper is provided, including a base body having a caliper braking area, two caliper brake units and two swinging units. Each caliper brake unit includes a rotating plate rotatably positioned within the base body, a braking plate, at least one driving mechanism and a first connecting member which is movable along an axis and disposed through and connected to the rotating plate, the braking plate is screwed with the first connecting member to be in co-movement relation, the braking plate is located between the rotating plate and the caliper braking area, and the at least one driving mechanism is disposed between the rotating plate and the braking plate. Each swinging unit includes a swinging portion and a second connecting member, the swinging portion is connected to the rotating plate via the second connecting member to be in co-rotation relation.

Abstract: A dimming system comprises a controller and an AC-to-DC converter. The controller outputs a control signal in response to a dimming signal. The controller comprises a frequency adjustment circuit and a duty cycle adjustment circuit. The frequency adjustment circuit adjusts the frequency of the control signal in response to the dimming signal. The duty cycle adjustment circuit adjusts the duty cycle of the control signal in response to the dimming signal. The AC-to-DC converter converts an external power and to output a DC signal in response to the control signal so as to drive a light source by the DC signal. When the controller is operated at a first mode, the control signal has a first frequency and a first duty cycle. When the controller switches to a second mode, the control signal has a second frequency and a second duty cycle.

Abstract: A dimming system comprises a controller and an AC-to-DC converter. The controller outputs a control signal in response to a dimming signal. The controller comprises a frequency adjustment circuit and a duty cycle adjustment circuit. The frequency adjustment circuit adjusts the frequency of the control signal in response to the dimming signal. The duty cycle adjustment circuit adjusts the duty cycle of the control signal in response to the dimming signal. The AC-to-DC converter converts an external power and to output a DC signal in response to the control signal so as to drive a light source by the DC signal. When the controller is operated at a first mode, the control signal has a first frequency and a first duty cycle. When the controller switches to a second mode, the control signal has a second frequency and a second duty cycle.

Abstract: A method for planarizing semiconductor devices, wherein the method comprises steps as follows: At least one patterned metal layer is formed on a substrate. A material layer having a first area and a second area is provided on the patterned metal layer and the substrate, in which there is a step height existing between the first area and the second area. A first polishing process having a first selection ratio of relative speeds for removing the material layer at the first area to that at the second area is then performed on the material layer. Subsequently, a second polishing process having a second selection ratio of relative speeds for removing the material layer at the first area to that at the second area is performed on the material layer, and the second selection ratio is greater than the first selection ratio.

Abstract: A method for planarizing semiconductor devices, wherein the method comprises steps as follows: At least one patterned metal layer is formed on a substrate. A material layer having a first area and a second area is provided on the patterned metal layer and the substrate, in which there is a step height existing between the first area and the second area. A first polishing process having a first selection ratio of relative speeds for removing the material layer at the first area to that at the second area is then performed on the material layer. Subsequently, a second polishing process having a second selection ratio of relative speeds for removing the material layer at the first area to that at the second area is performed on the material layer, and the second selection ratio is greater than the first selection ratio.

Abstract: A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge control ring is disposed between the retaining ring and the membrane, including a bottom part that has an abutting surface. The abutting surface of the edge control ring contacts with the external surface of the lip part of the membrane when the membrane is not inflated.