Abstract: A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.

Abstract: A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.

Abstract: A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.

Abstract: A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.

Abstract: A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

Abstract: A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

Abstract: A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

Abstract: A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.

Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.