Abstract: An image sensor includes an image sensor die, a light transmitting element, at least one anti-reflection coating and at least one anti-reflection structure. The image sensor die includes a photoelectric conversion layer and a micro lens layer. The micro lens layer is disposed above the photoelectric conversion layer for converging the light onto the photoelectric conversion layer. The light transmitting element is disposed above the micro lens layer, and a gap is formed between the light transmitting element and the micro lens layer, the light passes through the light transmitting element and then travels into the image sensor. The anti-reflection coating is at least disposed on an upper surface of the light transmitting element. The anti-reflection structure is disposed on at least one of a lower surface of the light transmitting element and the micro lens layer.

Abstract: An imaging lens module includes a sensing part, a lens assembly, a lens holding member, an isolating article and a plastic molding article. The sensing part includes a substrate, a sensing chip and a plurality of conducting wires. The substrate supports the sensing chip. The sensing chip includes an optical effect area and an electrical connection area. The conducting wires are electrically connected to the electrical connection area for transmitting an image signal. The lens assembly corresponds to the optical effect area. The lens holding member holds the lens assembly. The lens holding member includes a wire correspondence structure corresponding to the conducting wires. The isolating article is between the wire correspondence structure and the conducting wires. The plastic molding article is molded on the sensing part. The plastic molding article physically contacts the lens holding member to fix the lens holding member with respect to the sensing part.

Abstract: The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Abstract: A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250?; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Abstract: A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.

Abstract: The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.

Abstract: A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Abstract: A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Abstract: A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Abstract: An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Abstract: The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250° C.; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Abstract: A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Abstract: The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: A lens module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Abstract: A method for making a lens module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a lens barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Abstract: A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Abstract: An optical device. A first yoke is connected to a support base. A second yoke is connected to the support base and opposes the first yoke. A lens module is movably disposed in the support base and between the first and second yokes. At least one magnetic member is comnected to the lens module and disposed between the first and second yokes. A coil is connected to the support base and disposed between the first and second yokes. The coil surrounds the magnetic member and lens module and is separated from the magnetic member. At least one elastic suspension rod is connected to the support base and lens module, supporting the lens module.

Abstract: An optical image device, having a lens module, an IR cut coating and an image sensor. The lens module has a molded glass aspheric lens and aspheric lens. The molded glass aspheric lens is disposed at one end near an object of which the image is to be captured, the IR cut coating is formed on the molded glass aspheric lens, and the image sensor is located behind the lens module to capture the image of the object. In addition to the lens module, the IR cut coating and the image sensor, the optical image device may further include a protective glass disposed on the image sensor.