Abstract: A semiconductor manufacturing apparatus includes an air distributor inside a chamber. The air distributor includes a first annular plate and a second annular plate disposed in an interior volume of the chamber, and an inner surface of the first annular plate and an inner surface of the second annular plate are connected to each other. A hollow region is defined by the first annular plate and the second annular plate. A gas through hole is extended from an outer surface of the first annular plate to the inner surface of the first annular plate. A plurality of ditches are between the inner surface of the first annular plate and the inner surface of the second annular plate, wherein the ditches are connected with the gas through hole and extended from the gas through hole to the hollow region to blow gas toward the hollow region.

Abstract: A semiconductor manufacturing apparatus includes an air distributor inside a chamber. The air distributor includes a first annular plate and a second annular plate disposed in an interior volume of the chamber, and an inner surface of the first annular plate and an inner surface of the second annular plate are connected to each other. A hollow region is defined by the first annular plate and the second annular plate. A gas through hole is extended from an outer surface of the first annular plate to the inner surface of the first annular plate. A plurality of ditches are between the inner surface of the first annular plate and the inner surface of the second annular plate, wherein the ditches are connected with the gas through hole and extended from the gas through hole to the hollow region to blow gas toward the hollow region.

Abstract: A semiconductor manufacturing apparatus includes a chamber, a view port window on a sidewall of the chamber and configured to receive an optical emission spectroscopy (OES); and an air distributor located between the view port window and an inner space of the chamber. The air distributor includes a hollow region aligned with the transparent window and configured to generate an air curtain in the hollow region to isolate the view port from the inner space.

Abstract: An apparatus for processing a semiconductor wafer includes a factory interface configured to couple with a manufacturing chamber. The factory interface includes a robot; an orienter adjacent to the robot; and a particle remover above the orienter and facing toward a wafer. The particle remover is configured to blow ionized gas on a surface of the wafer so as to remove particles.

Abstract: A semiconductor manufacturing apparatus includes a chamber, a view port window on a sidewall of the chamber and configured to receive an optical emission spectroscopy (OES); and an air distributor located between the view port window and an inner space of the chamber. The air distributor includes a hollow region aligned with the transparent window and configured to generate an air curtain in the hollow region to isolate the view port from the inner space.