Patents by Inventor TZU-LI LIU

TZU-LI LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structure and forming method thereof
    Patent number: 11955441
    Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Epitaxial structures exposed in airgaps for semiconductor devices
    Patent number: 11923409
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Display device with front-facing concealable interfaces
    Patent number: 9197839
    Abstract: A display device includes a casing, a display unit received in a front of the casing, and a connector assembly which can be rotated to be front-facing, for plugging in ancillary devices, and the connector assembly can be rotated back to hide the plugs of the ancillary devices and be hidden itself behind a front cover, to preserve the aesthetic appeal of the display device.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: November 24, 2015
    Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.
    Inventors: Wen-Chin Lin, Ching-Jou Chen, Tzu-Li Liu, Wen-Chieh Wang, Sheng-Tien Chang, Chin-Ming Chen
  • DISPLAY DEVICE WITH FRONT-FACING CONCEALABLE INTERFACES
    Publication number: 20140328010
    Abstract: A display device includes a casing, a display unit received in a front of the casing, and a connector assembly which can be rotated to be front-facing, for plugging in ancillary devices, and the connector assembly can be rotated back to hide the plugs of the ancillary devices and be hidden itself behind a front cover, to preserve the aesthetic appeal of the display device.
    Type: Application
    Filed: May 24, 2013
    Publication date: November 6, 2014
    Inventors: WEN-CHIN LIN, CHING-JOU CHEN, TZU-LI LIU, WEN-CHIEH WANG, SHENG-TIEN CHANG, CHIN-MING CHEN