Abstract: Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.

Abstract: Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.

Abstract: A pad structure for speaker cabinet includes a lower disk having a plurality of recesses defined in a top surface thereof, an upper disk having a corresponding number of recesses defined at positions on a bottom surface thereof facing to the recesses of the lower disk, respectively, and a corresponding number of balls. Each of the balls is sandwiched between one of the recesses of the lower disk and a corresponding one of the recesses of the upper disk. The pad structure is put under the speaker cabinet to reduce the vibration generated by the cabinet when the speaker produces sound, provide the reaction force necessary for the speaker when producing sound and effectively insulate the cabinet from the vibration due to the natural resonance of the place where the cabinet is positioned.