Patents by Inventor Tzu-Ping Cheng

Tzu-Ping Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabricating method of flexible circuit board
    Patent number: 8828245
    Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 9, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
  • Carrier-attached copper foil and method for manufacturing the same
    Patent number: 8808873
    Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: August 19, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
  • FABRICATING METHOD OF FLEXIBLE CIRCUIT BOARD
    Publication number: 20120241082
    Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.
    Type: Application
    Filed: October 18, 2011
    Publication date: September 27, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
  • CARRIER-ATTACHED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120097544
    Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.
    Type: Application
    Filed: October 20, 2011
    Publication date: April 26, 2012
    Inventors: Yu-Chung CHEN, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng