Patents by Inventor Tzu-Sheng Wu

Tzu-Sheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147711
    Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
  • Publication number: 20240120304
    Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 11, 2024
    Applicant: Innolux Corporation
    Inventors: Tzu-Sheng Wu, Haw-Kuen Liu, Chung-Jyh Lin, Cheng-Chi Wang, Wen-Hsiang Liao, Te-Hsun Lin
  • Patent number: 11923252
    Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sai-Hooi Yeong, Bo-Feng Young, Chi-On Chui, Chih-Chieh Yeh, Cheng-Hsien Wu, Chih-Sheng Chang, Tzu-Chiang Chen, I-Sheng Chen
  • Publication number: 20180061811
    Abstract: A semiconductor package includes a first chip, a second chip, a plurality of first conductive bumps, a plurality of second conductive bumps and an underfill. The first chip includes a first active surface having a chip bonding zone, a plurality of first inner pads in the chip bonding zone and a plurality of first outer pads out of the chip bonding zone. The second chip is flipped on the chip bonding zone. The first conductive bumps are disposed on the first outer pads. The second conductive bumps are disposed between the first inner pads of the first chip and a plurality of second pads of the second chip. The underfill is disposed on the first active surface and covers the second conductive bumps, at least a part of each second chip lateral and at least a part of each first conductive bump. Multiple semiconductor package manufacturing methods are further provided.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 1, 2018
    Applicant: ChipMOS Technologies Inc.
    Inventors: Geng-Shin Shen, Ching-Chen Tu, Tzu-Sheng Wu, Chun-Chen Lin, Hui-Wen Yeh
  • Patent number: 6855346
    Abstract: The present invention provides a method for treating patients with liver diseases by co-administrating a pharmaceutical composition and lamivudine to the patients. The pharmaceutical composition is a herbal mixture which contains, as the core ingredients, the aqueous extracts of the entire plant of Herba Hedyotidis diffusae, the rhizome of Rhizoma Bistortae, the rhizome of Rhizoma Polygoni Cuspidati, and the ripe fruit of Fructus Schisandrae. The present invention also provides methods for preventing a relapse of hepatitis in patients after the lamivudine treatment has been discontinued and for suppressing the development of lamivudine drug resistance in patients by providing the lamivudine-treated patients with the pharmaceutical composition of the present invention.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: February 15, 2005
    Inventor: Tzu-Sheng Wu
  • Patent number: 6696094
    Abstract: The present invention provides a pharmaceutical composition for treating patients with HIV infection. The pharmaceutical composition is in the form of an intravenous injection solution and optionally capsules. The pharmaceutical composition contains fourteen (14) ingredients, i.e., diffuse hedyotis, bistort rhizome, giant knotweed rhizome, Asiatic moonseed rhizome, baical skullcap root, bovine biliary powder, milkvetch root, barbary wolfberry fruit, sanqi, figwort root, Chinese magnoliavine fruit, turmeric root-tuber, hawthorn fruit, and Chinese angelica.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: February 24, 2004
    Inventor: Tzu-Sheng Wu
  • Publication number: 20030147969
    Abstract: The present invention provides a method for treating patients with liver diseases by co-administrating a pharmaceutical composition and lamivudine to the patients. The pharmaceutical composition is a herbal mixture which contains, as the core ingredients, the aqueous extracts of the entire plant of Herba Hedyotidis diffusae, the rhizome of Rhizoma Bistortae, the rhizome of Rhizoma Polygoni Cuspidati, and the ripe fruit of Fructus Schisandrae. The present invention also provides methods for preventing a relapse of hepatitis in patients after the lamivudine treatment has been discontinued and for suppressing the development of lamivudine drug resistance in patients by providing the lamivudine-treated patients with the pharmaceutical composition of the present invention.
    Type: Application
    Filed: July 11, 2002
    Publication date: August 7, 2003
    Inventor: Tzu-Sheng Wu
  • Publication number: 20030091658
    Abstract: The present invention provides a pharmaceutical composition for treating patients with HIV infection. The pharmaceutical composition is in the form of an intravenous injection solution and optionally capsules. The pharmaceutical composition contains fourteen (14) ingredients, i.e., diffuse hedyotis, bistort rhizome, giant knotweed rhizome, Asiatic moonseed rhizome, baical skullcap root, bovine biliary powder, milkvetch root, barbary wolfberry fruit, sanqi, figwort root, Chinese magnoliavine fruit, turmeric root-tuber, hawthorn fruit, and Chinese angelica.
    Type: Application
    Filed: July 31, 2002
    Publication date: May 15, 2003
    Inventor: Tzu-Sheng Wu
  • Patent number: 6455078
    Abstract: The present invention provides a herbal pharmaceutical composition for treating patients with liver diseases and/or HIV. The composition contains fifteen (15) ingredients, which are diffuse hedyotis, bistort rhizome, giant knotweed rhizome, Asiatic moonseed rhizome, baical skullcap root, bovine biliary powder, milkvetch root, barbary wolfberry fruit, sanqi, red ginseng, figwort root, Chinese magnoliavine fruit, turmeric root-tuber, hawthorn fruit, and Chinese angelica. Among the fifteen (15) ingredients, diffuse hedyotis, bistort rhizome, giant knotweed rhizome, and Chinese magnoliavine fruit are the required herbs which contribute to the efficacy of the pharmaceutical composition.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: September 24, 2002
    Inventor: Tzu-Sheng Wu
  • Publication number: 20020076446
    Abstract: The present invention provides a herbal pharmaceutical composition for treating patients with liver diseases and/or HIV. The composition contains fifteen (15) ingredients, which are diffuse hedyotis, bistort rhizome, giant knotweed rhizome, Asiatic moonseed rhizome, baical skullcap root, bovine biliary powder, milkvetch root, barbary wolfberry fruit, sanqi, red ginseng, figwort root, Chinese magnoliavine fruit, turmeric root-tuber, hawthorn fruit, and Chinese angelica. Among the fifteen (15) ingredients, diffuse hedyotis, bistort rhizome, giant knotweed rhizome, and Chinese magnoliavine fruit are the required herbs which contribute to the efficacy of the pharmaceutical composition.
    Type: Application
    Filed: July 18, 2001
    Publication date: June 20, 2002
    Inventor: Tzu-Sheng Wu