Patents by Inventor Tzu-Shun YANG

Tzu-Shun YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230093450
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a first mandrel layer on a material layer disposed on a substrate. A first spacer layer is conformally formed on sidewalls of the first mandrel layer, wherein the first spacer layer comprises a doped silicon material. The first mandrel layer is selectively removed while keeping the first spacer layer. A second spacer layer is conformally formed on sidewalls of the first spacer layer and selectively removing the first spacer layer while keeping the second spacer layer.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 23, 2023
    Inventors: Tzu-shun YANG, Rui CHENG, Karthik JANAKIRAMAN, Zubin HUANG, Diwakar KEDLAYA, Meenakshi GUPTA, Srinivas GUGGILLA, Yung-chen LIN, Hidetaka OSHIO, Chao LI, Gene LEE
  • Patent number: 11527408
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a first mandrel layer on a material layer disposed on a substrate. A first spacer layer is conformally formed on sidewalls of the first mandrel layer, wherein the first spacer layer comprises a doped silicon material. The first mandrel layer is selectively removed while keeping the first spacer layer. A second spacer layer is conformally formed on sidewalls of the first spacer layer and selectively removing the first spacer layer while keeping the second spacer layer.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: December 13, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya, Meenakshi Gupta, Srinivas Guggilla, Yung-chen Lin, Hidetaka Oshio, Chao Li, Gene Lee
  • Publication number: 20220198333
    Abstract: A method includes training a machine learning model with data input including one or more sets of historical recipe parameters associated with producing one or more substrates with substrate processing equipment and target data including historical performance data of the one or more substrates to generate a trained machine learning model. The method further includes identifying one or more sets of additional recipe parameters associated with a level of uncertainty of the trained machine learning model. The method further includes further training the machine learning model with additional data input including the one or more sets of additional recipe parameters and additional target data including additional performance data of one or more additional substrates produced based on the one or more sets of additional recipe parameters to update the trained machine learning model.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 23, 2022
    Inventors: Robert Charles Pack, Regina Germanie Freed, Madhur Singh Sachan, Tzu-Shun Yang
  • Patent number: 11315787
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a mandrel layer on a substrate, conformally forming a spacer layer on the mandrel layer, wherein the spacer layer is a doped silicon material, and patterning the spacer layer. In another embodiment, a method for forming features on a substrate includes conformally forming a spacer layer on a mandrel layer on a substrate, wherein the spacer layer is a doped silicon material, selectively removing a portion of the spacer layer using a first gas mixture, and selectively removing the mandrel layer using a second gas mixture different from the first gas mixture.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: April 26, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya, Meenakshi Gupta, Srinivas Guggilla, Yung-chen Lin, Hidetaka Oshio, Chao Li, Gene Lee
  • Publication number: 20200335339
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a first mandrel layer on a material layer disposed on a substrate. A first spacer layer is conformally formed on sidewalls of the first mandrel layer, wherein the first spacer layer comprises a doped silicon material. The first mandrel layer is selectively removed while keeping the first spacer layer. A second spacer layer is conformally formed on sidewalls of the first spacer layer and selectively removing the first spacer layer while keeping the second spacer layer.
    Type: Application
    Filed: May 5, 2020
    Publication date: October 22, 2020
    Inventors: Tzu-shun YANG, Rui CHENG, Karthik JANAKIRAMAN, Zubin HUANG, Diwakar KEDLAYA, Meenakshi GUPTA, Srinivas GUGGILLA, Yung-chen LIN, Hidetaka OSHIO, Chao LI, Gene LEE
  • Publication number: 20200335338
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a mandrel layer on a substrate, conformally forming a spacer layer on the mandrel layer, wherein the spacer layer is a doped silicon material, and patterning the spacer layer. In another embodiment, a method for forming features on a substrate includes conformally forming a spacer layer on a mandrel layer on a substrate, wherein the spacer layer is a doped silicon material, selectively removing a portion of the spacer layer using a first gas mixture, and selectively removing the mandrel layer using a second gas mixture different from the first gas mixture.
    Type: Application
    Filed: March 17, 2020
    Publication date: October 22, 2020
    Inventors: Tzu-Shun YANG, Rui CHENG, Karthik JANAKIRAMAN, Zubin HUANG, Diwakar KADLAYA, Meenakshi GUPTA, Srinivas GUGGILLA, Yung-chen LIN, Hidetaka OSHIO, Chao LI, Gene LEE