Abstract: A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.

Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: A supporting shelf module includes a plurality of plastic supporting plates parallelly arranged in a height direction, and at least one pair of metal-made connectors located at two opposite ends of the supporting plates in the height direction. The connectors in one pair are correspondingly located in two horizontal planes perpendicular to the height direction. A wafer container is also disclosed, which includes a container body having at least two sets of the supporting shelf modules mounted therein, at least two top retaining brackets and at least two bottom retaining grooves provided on an inward side of a top and a bottom panel of the container body, respectively. The supporting shelf module has upper ends engaged with the top retaining brackets and lower ends engaged with and limited to the bottom retaining grooves in an engaging direction. Thus, the tolerance problem of the conventional wafer shelf can be solved.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An output circuit includes: an output switch including a gate terminal, a drain terminal coupled to an external I/O bus, and a well terminal; a well control circuit, having a well terminal coupled to the well terminal of the output switch, to maintain a well voltage of the output switch at a level not less than a greater of a first voltage and a second voltage; and a gate control circuit coupled to the gate terminal and a the drain terminal of the output switch and to the external I/O bus, and operable to turn off the output switch, to prevent current flow through the output switch from the external I/O bus when an operating voltage of the output circuit is not applied to the output switch, and a bus voltage from an external device is present on the external I/O bus.

Abstract: The present invention discloses a wearable electronic device having a plurality of trapezoid structures rotatably connected with one another. At least one inclined surface is formed on two ends of each trapezoid structure. When protruding sides of adjacent inclined surfaces of adjacent trapezoid structures abut against each other and sunken sides of the adjacent inclined surfaces of the adjacent trapezoid structures abut against each other, the plurality of trapezoid structures is formed in a ring shape. When the protruding sides and the sunken sides of the adjacent inclined surfaces of the adjacent trapezoid structures abut against each other, the plurality of trapezoid structures is formed in a straight shape.

Abstract: The present invention discloses a wearable electronic device having a plurality of trapezoid structures rotatably connected with one another. At least one inclined surface is formed on two ends of each trapezoid structure. When protruding sides of adjacent inclined surfaces of adjacent trapezoid structures abut against each other and sunken sides of the adjacent inclined surfaces of the adjacent trapezoid structures abut against each other, the plurality of trapezoid structures is formed in a ring shape. When the protruding sides and the sunken sides of the adjacent inclined surfaces of the adjacent trapezoid structures abut against each other, the plurality of trapezoid structures is formed in a straight shape.