Patents by Inventor Tzu-Wei GU

Tzu-Wei GU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10876798
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 29, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Tzu-Wei Gu
  • Publication number: 20190264987
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: COOLER MASTER CO.,LTD.
    Inventors: Chien-Hung SUN, Tzu-Wei GU
  • Patent number: 10378828
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Grant
    Filed: February 11, 2017
    Date of Patent: August 13, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Tzu-Wei Gu
  • Publication number: 20170241717
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Application
    Filed: February 11, 2017
    Publication date: August 24, 2017
    Inventors: Chien-Hung SUN, Tzu-Wei GU