Abstract: A bag is filled with liquid, instead of an airbag filled with gas, to deform a bottom wafer toward a top wafer during a wafer bonding process. As a result, the liquid is less susceptible to temperature changes, which reduces run-out variation across wafer bonding processes. Reducing run-out variation conserves wasted wafers by increasing yield and reducing a quantity of non-functioning devices that are produced. Additionally, in some implementations, the liquid may be pre-heated before the bag is filled with the liquid. As a result, the bottom wafer (and, to some extent, the top wafer) experiences some thermal deformation and less mechanical deformation, which further increases yield and reduces a quantity of non-functioning devices that are produced.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes performing a bonding process to bond a first semiconductor substrate to a second semiconductor substrate. A shift measurement process is performed on the first and second semiconductor substrates. The shift measurement process includes moving a plurality of substrate pins from a plurality of initial positions to a plurality of measurement positions. The plurality of substrate pins are disposed outside of perimeters of the first and second semiconductor substrates. A shift value is determined between the first semiconductor substrate and the second semiconductor substrate based at least in part on a difference between the plurality of initial positions and the plurality of measurement positions.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes loading a first wafer and a second wafer onto a bonding platform such that the second wafer overlies the first wafer. An alignment process is performed to align the second wafer over the first wafer by virtue of a plurality of wafer pins, where a plurality of first parameters are associated with the wafer pins during the alignment process. The second wafer is bonded to the first wafer. An overlay (OVL) measurement process is performed on the first wafer and the second wafer by virtue of the plurality of wafer pins, where a plurality of second parameters are associated with the wafer pins during the alignment process.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes loading a first wafer and a second wafer onto a bonding platform such that the second wafer overlies the first wafer. An alignment process is performed to align the second wafer over the first wafer by virtue of a plurality of wafer pins, where a plurality of first parameters are associated with the wafer pins during the alignment process. The second wafer is bonded to the first wafer. An overlay (OVL) measurement process is performed on the first wafer and the second wafer by virtue of the plurality of wafer pins, where a plurality of second parameters are associated with the wafer pins during the alignment process.

Abstract: A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.

Abstract: A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.

Abstract: A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.

Abstract: A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.

Abstract: A multiple-fuel rotary engine includes a cylinder seat, a cylinder body, pistons, an intake/exhaust regulation module, a cover, and a top lid. The cylinder body has bores receives the pistons therein and when the cylinder body carries the pistons to rotate, making gas holes thereof positioned under an intake channel, the gas holes are first set in communication with a first sub-channel of the intake channel and then the second sub-channel, whereby two fuel supply systems respectively and sequentially supply two different fuels into the same bore to complete an intake stroke of two different air-fuel mixtures. Combustion of the air-fuel mixtures in the bore provides explosion energy that drives the piston outward to complete the operation of the engine.