Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A light pipe structure of an image sensing device including a substrate, a dielectric layer, and a light-pipe material layer is provided. The substrate has a light sensing region therein. The dielectric layer is disposed on the substrate. The dielectric layer has a light pipe therein, and the light pipe is located above the light sensing region. The light-pipe material layer is disposed in the light pipe and has a recessed curved surface.

Abstract: A method of fabricating a light pipe of an image sensing device including following steps is provided. A substrate is provided. The substrate includes a pixel region and a periphery region. A light sensing region has been formed in the substrate. The light sensing region is located in the pixel region. A dielectric layer is formed on the substrate. An interconnection structure and a light-blocking metal layer have been formed in the dielectric layer. The light-blocking metal layer is located over the interconnection structure, and the light-blocking metal layer has an opening exposing the light sensing region. A portion of the dielectric layer exposed by the opening is removed by using the light-blocking metal layer as a mask to form the light pipe in the dielectric layer.