Patents by Inventor Tzu-Wen LIAO
Tzu-Wen LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240176093Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: February 5, 2024Publication date: May 30, 2024Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Publication number: 20240162088Abstract: An integrated circuit device includes an interconnect layer, a memory structure, a third conductive feature, and a fourth conductive feature. The interconnect layer includes a first conductive feature and a second conductive feature. The memory structure is over and in contact with the first conductive feature. The memory structure includes at least a resistance switching element over the first conductive feature. The third conductive feature, including a first conductive line, is over and in contact with the second conductive feature. The fourth conductive feature is over and in contact with the memory structure. The fourth conductive feature includes a second conductive line, a top surface of the first conductive line is substantially level with a top surface of the second conductive line, and a bottom surface of the first conductive line is lower than a bottommost portion of a bottom surface of the second conductive line.Type: ApplicationFiled: January 25, 2024Publication date: May 16, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsia-Wei CHEN, Fu-Ting SUNG, Yu-Wen LIAO, Wen-Ting CHU, Fa-Shen JIANG, Tzu-Hsuan YEH
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11632882Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.Type: GrantFiled: April 8, 2021Date of Patent: April 18, 2023Assignee: LSC Ecosystem CorporationInventor: Tzu-Wen Liao
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Patent number: 11519672Abstract: A liquid-cooled heat dissipation device is disclosed, comprising a main body, a centrifugal pump, an inlet pipe, an outlet pipe, a centrifugal fan and a motor. The main body comprises a shaft hole, liquid flow channels and airflow channels. The centrifugal pump guides a cooling liquid through the inlet pipe, main body and outlet pipe. The centrifugal fan guides air into the main body axially from the shaft hole. After passing through the centrifugal fan, the air forms centrifugal airflows and leaves the body radially through the airflow channels. With an extended flow path of the cooling liquid and the radial flow of the centrifugal airflow provided by the present invention, the temperature of the cooling liquid may be quickly reduced and the cooling effect may be improved. Thus, the structure is compact, small, light-weight, easy-to-assemble.Type: GrantFiled: June 15, 2020Date of Patent: December 6, 2022Assignee: Gogoro Inc.Inventors: Sung-Ching Lin, Tzu-Wen Liao, Yi-Hsiang Lin, Kai-Chiang Li, Yi-Chen Lu
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Publication number: 20210321546Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.Type: ApplicationFiled: April 8, 2021Publication date: October 14, 2021Inventor: Tzu-Wen Liao
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Patent number: 11073338Abstract: A liquid-cooled heat dissipation device is disclosed, comprising a main body, a centrifugal pump, an inlet pipe and an outlet pipe. The main body comprises liquid flow channels and liquid storage tanks. The liquid flow channels are circumferentially arranged and spaced apart. The liquid storage tanks are located on both sides of the main body, and the liquid storage tanks on the same side are connected by liquid flow channels. The centrifugal pump is installed in one of the liquid storage tanks. The inlet pipe and the outlet pipe are in spatial communication with the other two liquid storage tanks, respectively. The centrifugal pump guides a cooling liquid through the inlet pipe, main body and outlet pipe. The cooling liquid travel through the liquid storage tanks via the liquid flow channels and forms radial jet flows after being pumped by centrifugal pump.Type: GrantFiled: June 15, 2020Date of Patent: July 27, 2021Assignee: Gogoro, Inc.Inventors: Sung-Ching Lin, Tzu-Wen Liao, Yi-Hsiang Lin, Kai-Chiang Li, Yi-Chen Lu
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Publication number: 20200392891Abstract: A liquid-cooled heat dissipation device is disclosed, comprising a main body, a centrifugal pump, an inlet pipe and an outlet pipe. The main body comprises liquid flow channels and liquid storage tanks. The liquid flow channels are circumferentially arranged and spaced apart. The liquid storage tanks are located on both sides of the main body, and the liquid storage tanks on the same side are connected by liquid flow channels. The centrifugal pump is installed in one of the liquid storage tanks. The inlet pipe and the outlet pipe are in spatial communication with the other two liquid storage tanks, respectively. The centrifugal pump guides a cooling liquid through the inlet pipe, main body and outlet pipe. The cooling liquid travel through the liquid storage tanks via the liquid flow channels and forms radial jet flows after being pumped by centrifugal pump.Type: ApplicationFiled: June 15, 2020Publication date: December 17, 2020Inventors: Sung-Ching Lin, Tzu-Wen Liao, Yi-Hsiang Lin, Kai-Chiang Li, Yi-Chen Lu
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Publication number: 20200393200Abstract: A liquid-cooled heat dissipation device is disclosed, comprising a main body, a centrifugal pump, an inlet pipe, an outlet pipe, a centrifugal fan and a motor. The main body comprises a shaft hole, liquid flow channels and airflow channels. The centrifugal pump guides a cooling liquid through the inlet pipe, main body and outlet pipe. The centrifugal fan guides air into the main body axially from the shaft hole. After passing through the centrifugal fan, the air forms centrifugal airflows and leaves the body radially through the airflow channels. With an extended flow path of the cooling liquid and the radial flow of the centrifugal airflow provided by the present invention, the temperature of the cooling liquid may be quickly reduced and the cooling effect may be improved. Thus, the structure is compact, small, light-weight, easy-to-assemble.Type: ApplicationFiled: June 15, 2020Publication date: December 17, 2020Inventors: Sung-Ching Lin, Tzu-Wen Liao, Yi-Hsiang Lin, Kai-Chiang Li, Yi-Chen Lu
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Patent number: 9479716Abstract: An image processing method comprises: receiving a first image; setting at least one first region on the first image, where the first image comprises at least one line; calculating a first average value of the first region; performing computation on the first image with a first parameter set to generate a second image; setting a second region of the second image according to the first region, and calculating a second average value of the second region; calculating a difference between the first average value and the second average value; and determining whether to replace the first image with the second image according to the difference.Type: GrantFiled: October 17, 2014Date of Patent: October 25, 2016Assignee: ABILITY ENTERPRISE CO., LTD.Inventors: Tzu-Wen Liao, Yi-Jian Lee
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Publication number: 20150117770Abstract: An image processing method comprises: receiving a first image; setting at least one first region on the first image, where the first image comprises at least one line; calculating a first average value of the first region; performing computation on the first image with a first parameter set to generate a second image; setting a second region of the second image according to the first region, and calculating a second average value of the second region; calculating a difference between the first average value and the second average value; and determining whether to replace the first image with the second image according to the difference.Type: ApplicationFiled: October 17, 2014Publication date: April 30, 2015Applicant: ABILITY ENTERPRISE CO., LTD.Inventors: Tzu-Wen LIAO, Yi-Jian Lee