Patents by Inventor Tzu-Wen TSENG

Tzu-Wen TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package including recess in side edge
    Patent number: 9601460
    Abstract: A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: March 21, 2017
    Assignee: XINTEC INC.
    Inventors: Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng, Shu-Ming Chang, Tzu-Wen Tseng
  • CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    Publication number: 20150228536
    Abstract: A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.
    Type: Application
    Filed: February 10, 2015
    Publication date: August 13, 2015
    Inventors: Yen-Shih HO, Tsang-Yu LIU, Chia-Sheng LIN, Chia-Ming CHENG, Shu-Ming CHANG, Tzu-Wen TSENG