Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: An electronic device includes a substrate, a first bus line, a second bus line, a plurality of driving units, a first signal line and a second signal line. The first bus line is disposed on the substrate and outputs a first signal. The second bus line is disposed on the substrate and outputs a second signal. The driving units are disposed between the first bus line and the second bus line, and include a first driving unit and a second driving unit which are adjacent to each other. The first signal line is electrically connected to the first bus line and transmits the first signal to the first driving unit and the second driving unit. The second signal line is electrically connected to the second bus line and transmits the second signal to at least one of the first driving unit and the second driving unit.

Abstract: A supporting assembly for a LCD includes a front bezel, a cover, a first fastener, a back bezel, a second fastener, a frame, a lighting carrier. The cover is extended from the front bezel. The first fastener is disposed on the cover. The back bezel is coupled to the front bezel and has an opening opposite the cover. The second fastener is disposed on the back bezel and fastened to the first fastener. The frame is disposed between the front bezel and the back bezel and has a carrier socket opposite the cover. The lighting carrier is plugged into the carrier socket.

Abstract: The present invention provides a light source module for using in a backlight module which includes a frame, a light source and a lid. The frame has two opposite side walls, and each of the side walls includes an inner side surface, a top surface and a cave. The cave has a first opening and a second opening connected with each other on the inner surface and the top surface respectively. Each of the inner surfaces is facing the other side wall, and the top surface intersects the inner surface with an angle. A light source has two opposite ends, and each of ends includes a positioning block. The positioning block engages with the cave through the second opening, and the light source extends along a first direction perpendicular to the inner surface, through the first opening and towards the opposite side wall of the frame. The lid covers the second opening and restricts the positioning block from moving relatively to the cave from the second opening.

Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

Abstract: The present invention provides a light source module for using in a backlight module which includes a frame, a light source and a lid. The frame has two opposite side walls, and each of the side walls includes an inner side surface, a top surface and a cave. The cave has a first opening and a second opening connected with each other on the inner surface and the top surface respectively. Each of the inner surfaces is facing the other side wall, and the top surface intersects the inner surface with an angle. A light source has two opposite ends, and each of ends includes a positioning block. The positioning block engages with the cave through the second opening, and the light source extends along a first direction perpendicular to the inner surface, through the first opening and towards the opposite side wall of the frame. The lid covers the second opening and restricts the positioning block from moving relatively to the cave from the second opening.

Abstract: A supporting assembly for a LCD includes a front bezel, a cover, a first fastener, a back bezel, a second fastener, a frame, a lighting carrier. The cover is extended from the front bezel. The first fastener is disposed on the cover. The back bezel is coupled to the front bezel and has an opening opposite the cover. The second fastener is disposed on the back bezel and fastened to the first fastener. The frame is disposed between the front bezel and the back bezel and has a carrier socket opposite the cover. The lighting carrier is plugged into the carrier socket.

Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.