Abstract: A photosensitive chip package includes a substrate on which a photosensitive chip having a photo-active zone and a photo-inactive zone surrounding the photo-active zone is bonded. A light-transmissive film covers the photo-active zone of the photosensitive chip. Bonding wires are electrically connected with the photosensitive chip and the substrate. An encapsulant covers the photo-inactive zone of the photosensitive chip, a border periphery of the light-transmissive film and the bonding wires. The encapsulant has an opening corresponding to the photo-active zone. By means of the light-transmissive film, the photo-active zone of the photosensitive chip is protected, thereby lowering the chance of accidental damage to the photosensitive chip by the tool used during formation of the encapsulant and/or during a cleaning work.

Abstract: A MEMS module package includes a substrate, a cap capped on the substrate and defining with the substrate an accommodation chamber, a micro-electromechanical chip mounted on the substrate within the accommodation chamber, a plurality of passive components mounted on the substrate within the accommodation chamber and electrically connected to the micro-electromechanical chip.

Abstract: A photosensitive chip package includes a substrate, a photosensitive chip bonded on the substrate and having a photo-active zone and a photo-inactive zone surrounding the photo-active zone, a plurality of bonding wires electrically connected with the photosensitive chip and the substrate, and an encapsulant covering the photo-inactive zone of the photosensitive chip, the bonding wires and a part of the substrate and having an opening corresponding to the photo-active zone of the photosensitive chip.

Abstract: A photo-sensitive chip module package includes a substrate, a photo-sensitive chip installed on the substrate and having a photo-sensitive zone, a plurality of passive components installed on the substrate, and a plurality of bonding wires electrically connected with the photo-sensitive chip and the passive components to the substrate. A cap is capped on the substrate and defines with the substrate an accommodation chamber that receives the photo-sensitive chip and the passive components. The cap has a light transmissive zone corresponding to the photo-sensitive zone of the photo-sensitive chip for allowing light to stream on the photo-sensitive zone of the photo-sensitive chip.

Abstract: A MEMS module package includes a substrate, a silicon chip attached on the substrate and having an active zone and an inactive zone surrounding around the active zone, a plurality of bonding wires electrically connected the silicon chip and the substrate, and an encapsulant formed between the inactive zone of the silicon chip and the substrate to encapsulate the inactive zone of the silicon, the bonding wires and a part of the substrate in such a manner that the active zone of the silicon chip is exposed outside the encapsulant. The MEMS module package uses a molding technique to substitute for the conventional cap package, thereby simplifying the packaging procedure and saving much the cost of manufacturing.

Abstract: A photosensitive chip molding package includes a lead frame, a photosensitive chip mounted on the lead frame and having an photo-active zone and a photo-inactive zone surrounding the photo-active zone, a plurality of bonding wires electrically connected with the photosensitive chip and the lead frame, and an encapsulant molded on the photo-inactive zone of the photosensitive chip and the lead frame. The encapsulant covers the photo-inactive zone, the bonding wires and a part of the lead frame to define an opening corresponding to the photo-active zone. The encapsulant is made of light-blocking material.